| Titre : | Equipment design and control of advanced thermal-processing module in lithography |
| Auteurs : | Tay, Arthur, Auteur ; Chua, Hui Tong, Auteur ; Wang, Yuheng, Auteur |
| Type de document : | Article : texte imprimé |
| Dans : | IEEE transactions on industrial electronics (Vol. 57 N° 3, Mars 2010) |
| Article en page(s) : | pp. 1112 - 1119 |
| Note générale : | Génie électrique |
| Langues : | Anglais |
| Index. décimale : | 621.38 (Dispositifs électroniques. Tubes à électrons. Photocellules. Accélérateurs de particules. Tubes à rayons X) |
| Tags : | Lithography Temperature control Thermal cycling Thermoelectric |
| Résumé : | A programmable multizone thermal-processing module is developed to achieve wafer-temperature uniformity during the thermal-cycling process in lithography. The bake and chill steps are conducted sequentially within the same module without any substrate movement. An array of thermoelectric devices (TEDs) is used to provide a distributed heating to the substrate for uniformity and transient temperature control. The TEDs also provide active cooling for chilling the substrate to a temperature suitable for subsequent processing steps. This design is an improvement of a previous work, eliminating the need of a mica heater. The system is designed via detailed modeling and simulations based on first-principle heat-transfer analysis. Experimental results on the prototype demonstrate about ±0.4°C spatial uniformity during the entire thermal cycle. |
| DEWEY : | 621.38 |
| ISSN : | 0278-0046 |
| En ligne : | http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5153311 |
