Earthquake engineering structural dynamics : the journal of the international association for earthquake engineering, Vol. 38 N° 6. Earthquake engineering structural dynamics - Mai 2009
| Titre : | Earthquake engineering structural dynamics : the journal of the international association for earthquake engineering, Vol. 38 N° 6. Earthquake engineering structural dynamics - Mai 2009 |
| Type de document : | Bulletin |
| Paru le : | 13/07/2009 |
Dépouillements
Article : texte imprimé
Wen-Shao Chang, Auteur ;
Jonathan Shanks, Auteur ;
Akihisa Kitamori, Auteur
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This study investigates the structural performance of interior, exterior and corner traditional timber joints found in a traditional temple in Japan subjected to bi-axial bending. A total of 36 half-scale specimens were fabricated and tested und[...]
Article : texte imprimé
Yuan-Tao Weng, Auteur ;
Tsai, Keh-Chyuan, Auteur ;
Pei-Ching Chen, Auteur
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The original structural design of this case study consisted of five basement floors and a 34-story hotel tower in Kaohsiung, Taiwan. The construction started in 1993, and the erection of the entire steel frame and the pouring of concrete slabs u[...]
Article : texte imprimé
Gian Paolo Cimellaro, Auteur ;
Oren Lavan, Auteur ;
Reinhorn, Andrei M., Auteur
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A design strategy for control of buildings experiencing inelastic deformations during seismic response is formulated. The strategy is using weakened, and/or softened, elements in a structural system while adding passive energy dissipation device[...]
Article : texte imprimé
Incremental dynamic analysis (IDA) has been extended by introducing a set of structural models in addition to the set of ground motion records which is employed in IDA analysis in order to capture record-to-record variability. The set of structu[...]
Article : texte imprimé
Dimitrios Konstantinidis, Auteur ;
Nicos Makris, Auteur
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This paper presents results of a comprehensive experimental program on the seismic response of full-scale freestanding laboratory equipment. First, quasi-static experiments are conducted to examine the mechanical behavior of the contact interfac[...]
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