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Résumé :
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Presented are the results of experiments that investigated nucleate boiling of PF-5060 on microporous Cu surface layers at saturation and 10 K, 20 K, and 30 K subcooling. The three microporous layers, electrochemically deposited on 10×10 mm2 Cu substrates and investigated herein, are ~139 µm, 171 µm, and 220 µm thick. The critical heat flux increases linearly with increased subcooling, Tsub, at an average rate of 4.5%/K. For the 171 µm thick, Cu microporous surface, saturation boiling CHF of 27.8 W/cm2 increases to 63.25 W/cm2 at Tsub=30 K, while the saturation hMNB of 13.5 W/cm2 K decreases slightly to 12.7 W/cm2 K at Tsub=30 K. The values of the surface superheat, Tsat, at hMNB and CHF increase from 2.0 K and 2.16 K at saturation to 4.2 and 6.42 K at 30 K subcooling.
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