| Titre : | Enhanced wet - chemical etching to prepare patterned silicon mask with controlled depths by combining photolithography with galvanic reaction (2012) |
| Auteurs : | Nannan Sun, Auteur ; Jianming Chen, Auteur ; Chao Jiang, Auteur |
| Type de document : | Article : texte imprimé |
| Dans : | Industrial & engineering chemistry research (Vol. 51 N° 2, Janvier 2012) |
| Article en page(s) : | pp. 788-794 |
| Note générale : | Chimie industrielle |
| Langues : | Anglais |
| Tags : | Chemical etching |
| Résumé : | We have developed an enhanced wet-chemical method to prepare patterned silicon templates with controlled depths at microscale by combining photolithography with electroless metal etching. The silicon masks are obtained in the following procedures: patterned silicon wafers selectively etch through galvanic reactions and result in patterned surfaces with silicon nanoarrays in exposed areas during photolithography; the as-etched silicon wafers are corroded in a mixture etching solution to remove silicon nanoarrays, leading to patterned silicon templates. |
| DEWEY : | 660 |
| ISSN : | 0888-5885 |
| En ligne : | http://cat.inist.fr/?aModele=afficheN&cpsidt=25476413 |
