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Self-contained, oscillating flow liquid cooling system for thin form factor high performance electronics / R. Wälchli in Journal of heat transfer, Vol. 132 N° 5 (Mai 2010) 

Public ISBD [article]  in Journal of heat transfer > Vol. 132 N° 5 (Mai 2010) . - pp. [051401-1/7] Titre : Self-contained, oscillating flow liquid cooling system for thin form factor high performance electronics Type de document : texte imprimé Auteurs : R. Wälchli, Auteur ; T. Brunschwiler, Auteur ; B. Michel, Auteur Article en page(s) : pp. [051401-1/7] Note générale : Physique Langues : Anglais (eng) Mots-clés : Microchannel  Liquid  cooling  Thermal  pachaging  Oscillating  flow Index. décimale : 536 Chaleur. Thermodynamique Résumé : A self-contained, small-volume liquid cooling system for thin form-factor electronic equipment (e.g., blade server modules) is demonstrated experimentally in this paper. A reciprocating water flow loop absorbs heat using mesh-type microchannel cold plates and spreads it periodically to a larger area. From there, the thermal energy is interchanged via large area, low pressure drop cold plates with a secondary heat transfer loop (air or liquid). Four phase-shifted piston pumps create either a linearly or radially oscillating fluid flow in the frequency range of 0.5–3 Hz. The tidal displacement of the pumps covers 42–120% of the fluid volume, and, therefore, an average flow rate range of 100–800 ml/min is tested. Three different absorber mesh designs are tested. Thermal and fluidic characteristics are presented in a time-resolved and a time-averaged manner. For a fluid pump power of 1 W, a waste heat flux of 180 W/cm2 (DeltaT=67 K) could be dissipated from a 3.5 cm2 chip. A linear oscillation flow pattern is advantageous over a radial one because of the more efficient heat removal from the chip and lower hydraulic losses. The optimum microchannel mesh density is determined as a combination of low pump losses and high heat transfer rates. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&smode=strresults& [...] [article] Self-contained, oscillating flow liquid cooling system for thin form factor high performance electronics [texte imprimé] / R. Wälchli, Auteur ; T. Brunschwiler, Auteur ; B. Michel, Auteur . - pp. [051401-1/7]. Physique Langues : Anglais (eng) in Journal of heat transfer > Vol. 132 N° 5 (Mai 2010) . - pp. [051401-1/7] Mots-clés : Microchannel  Liquid  cooling  Thermal  pachaging  Oscillating  flow Index. décimale : 536 Chaleur. Thermodynamique Résumé : A self-contained, small-volume liquid cooling system for thin form-factor electronic equipment (e.g., blade server modules) is demonstrated experimentally in this paper. A reciprocating water flow loop absorbs heat using mesh-type microchannel cold plates and spreads it periodically to a larger area. From there, the thermal energy is interchanged via large area, low pressure drop cold plates with a secondary heat transfer loop (air or liquid). Four phase-shifted piston pumps create either a linearly or radially oscillating fluid flow in the frequency range of 0.5–3 Hz. The tidal displacement of the pumps covers 42–120% of the fluid volume, and, therefore, an average flow rate range of 100–800 ml/min is tested. Three different absorber mesh designs are tested. Thermal and fluidic characteristics are presented in a time-resolved and a time-averaged manner. For a fluid pump power of 1 W, a waste heat flux of 180 W/cm2 (DeltaT=67 K) could be dissipated from a 3.5 cm2 chip. A linear oscillation flow pattern is advantageous over a radial one because of the more efficient heat removal from the chip and lower hydraulic losses. The optimum microchannel mesh density is determined as a combination of low pump losses and high heat transfer rates. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&smode=strresults& [...]