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Enhancement of saturation boiling of PF-5060 on microporous copper dendrite surfaces / Mohamed S. El-Genk in Journal of heat transfer, Vol. 132 N° 7 (Juillet 2010) 

Public ISBD [article]  in Journal of heat transfer > Vol. 132 N° 7 (Juillet 2010) . - pp. [071501-1/9] Titre : Enhancement of saturation boiling of PF-5060 on microporous copper dendrite surfaces Type de document : texte imprimé Auteurs : Mohamed S. El-Genk, Auteur ; Amir F. Ali, Auteur Article en page(s) : pp. [071501-1/9] Note générale : Physique Langues : Anglais (eng) Mots-clés : Pool  boiling  enhancement  Copper  nanodendrites  Electrochemical  deposition  Electronics  cooling  Dielectric  liquids Index. décimale : 536 Chaleur. Thermodynamique Résumé : Experiments are performed to investigate saturation boiling of degassed PF-5060 dielectric liquid on microporous copper dendrite surface layers deposited on 10×10 mm2 Cu substrates. The electrochemically deposited surface layers are of different thicknesses (145.6 µm, 46.3 µm, and 33.1 µm). The thickest layer gives the best results: the saturation CHF of 25.27 W/cm2 occurs at a surface superheat of only 2.9 K and the maximum nucleate boiling heat transfer coefficient, hMNB, near the end of the fully developed nucleate boiling region, is 8.76 W/cm2 K. In addition, nucleate boiling ensues at a surface temperature slightly above saturation (<0.5 K), with no temperature excursion. The temperature excursions before initiating boiling on the 46.3 µm and 33.1 µm thick Cu nanodendrite surface layers are small (3.7 K and 6 K), corresponding to surface temperatures of ~55.1°C and 57.4°C, respectively. These temperatures are much lower than recommended (85°C) for reliable operation of most silicon electronics and central processor units. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...] [article] Enhancement of saturation boiling of PF-5060 on microporous copper dendrite surfaces [texte imprimé] / Mohamed S. El-Genk, Auteur ; Amir F. Ali, Auteur . - pp. [071501-1/9]. Physique Langues : Anglais (eng) in Journal of heat transfer > Vol. 132 N° 7 (Juillet 2010) . - pp. [071501-1/9] Mots-clés : Pool  boiling  enhancement  Copper  nanodendrites  Electrochemical  deposition  Electronics  cooling  Dielectric  liquids Index. décimale : 536 Chaleur. Thermodynamique Résumé : Experiments are performed to investigate saturation boiling of degassed PF-5060 dielectric liquid on microporous copper dendrite surface layers deposited on 10×10 mm2 Cu substrates. The electrochemically deposited surface layers are of different thicknesses (145.6 µm, 46.3 µm, and 33.1 µm). The thickest layer gives the best results: the saturation CHF of 25.27 W/cm2 occurs at a surface superheat of only 2.9 K and the maximum nucleate boiling heat transfer coefficient, hMNB, near the end of the fully developed nucleate boiling region, is 8.76 W/cm2 K. In addition, nucleate boiling ensues at a surface temperature slightly above saturation (<0.5 K), with no temperature excursion. The temperature excursions before initiating boiling on the 46.3 µm and 33.1 µm thick Cu nanodendrite surface layers are small (3.7 K and 6 K), corresponding to surface temperatures of ~55.1°C and 57.4°C, respectively. These temperatures are much lower than recommended (85°C) for reliable operation of most silicon electronics and central processor units. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...]

Subcooled boiling of PF-5060 dielectric liquid on microporous surfaces / Mohamed S. El-Genk in Journal of heat transfer, Vol. 133 N° 8 (Août 2011) 

Public ISBD [article]  in Journal of heat transfer > Vol. 133 N° 8 (Août 2011) . - pp. [081503/1-8] Titre : Subcooled boiling of PF-5060 dielectric liquid on microporous surfaces Type de document : texte imprimé Auteurs : Mohamed S. El-Genk, Auteur ; Amir F. Ali, Auteur Année de publication : 2011 Article en page(s) : pp. [081503/1-8] Note générale : Physique Langues : Anglais (eng) Mots-clés : Subcoled  boiling  Microporous  copper  Electrochemical  deposition  Electronic  cooling  Dielectric  liquids Index. décimale : 536 Chaleur. Thermodynamique Résumé : Presented are the results of experiments that investigated nucleate boiling of PF-5060 on microporous Cu surface layers at saturation and 10 K, 20 K, and 30 K subcooling. The three microporous layers, electrochemically deposited on 10×10 mm2 Cu substrates and investigated herein, are ~139 µm, 171 µm, and 220 µm thick. The critical heat flux increases linearly with increased subcooling, Tsub, at an average rate of 4.5%/K. For the 171 µm thick, Cu microporous surface, saturation boiling CHF of 27.8 W/cm2 increases to 63.25 W/cm2 at Tsub=30 K, while the saturation hMNB of 13.5 W/cm2 K decreases slightly to 12.7 W/cm2 K at Tsub=30 K. The values of the surface superheat, Tsat, at hMNB and CHF increase from 2.0 K and 2.16 K at saturation to 4.2 and 6.42 K at 30 K subcooling. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=JHTRAO00013300 [...] [article] Subcooled boiling of PF-5060 dielectric liquid on microporous surfaces [texte imprimé] / Mohamed S. El-Genk, Auteur ; Amir F. Ali, Auteur . - 2011 . - pp. [081503/1-8]. Physique Langues : Anglais (eng) in Journal of heat transfer > Vol. 133 N° 8 (Août 2011) . - pp. [081503/1-8] Mots-clés : Subcoled  boiling  Microporous  copper  Electrochemical  deposition  Electronic  cooling  Dielectric  liquids Index. décimale : 536 Chaleur. Thermodynamique Résumé : Presented are the results of experiments that investigated nucleate boiling of PF-5060 on microporous Cu surface layers at saturation and 10 K, 20 K, and 30 K subcooling. The three microporous layers, electrochemically deposited on 10×10 mm2 Cu substrates and investigated herein, are ~139 µm, 171 µm, and 220 µm thick. The critical heat flux increases linearly with increased subcooling, Tsub, at an average rate of 4.5%/K. For the 171 µm thick, Cu microporous surface, saturation boiling CHF of 27.8 W/cm2 increases to 63.25 W/cm2 at Tsub=30 K, while the saturation hMNB of 13.5 W/cm2 K decreases slightly to 12.7 W/cm2 K at Tsub=30 K. The values of the surface superheat, Tsat, at hMNB and CHF increase from 2.0 K and 2.16 K at saturation to 4.2 and 6.42 K at 30 K subcooling. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=JHTRAO00013300 [...]