Documents disponibles écrits par cet auteur

Thermal characterization of interlayer microfluidic cooling of three-dimensional integrated circuits with nonuniform heat flux / Yoon Jo Kim in Journal of heat transfer, Vol. 132 N° 4 (n° spécial) (Avril 2010) 

Public ISBD [article]  in Journal of heat transfer > Vol. 132 N° 4 (n° spécial) (Avril 2010) . - pp. [041009-1/9] Titre : Thermal characterization of interlayer microfluidic cooling of three-dimensional integrated circuits with nonuniform heat flux Type de document : texte imprimé Auteurs : Yoon Jo Kim, Auteur ; Yogendra K. Joshi, Auteur ; Andrei G. Fedorov, Auteur Article en page(s) : pp. [041009-1/9] Note générale : Physique Langues : Anglais (eng) Mots-clés : Microchannel  Microfluidic  cooling  Three-dimensional  IC  Nonuniform  heat  flux  Single-phase  Two-phase  Pressure  drop Index. décimale : 536 Chaleur. Thermodynamique Résumé : It is now widely recognized that the three-dimensional (3D) system integration is a key enabling technology to achieve the performance needs of future microprocessor integrated circuits (ICs). To provide modular thermal management in 3D-stacked ICs, the interlayer microfluidic cooling scheme is adopted and analyzed in this study focusing on a single cooling layer performance. The effects of cooling mode (single-phase versus phase-change) and stack/layer geometry on thermal management performance are quantitatively analyzed, and implications on the through-silicon-via scaling and electrical interconnect congestion are discussed. Also, the thermal and hydraulic performance of several two-phase refrigerants is discussed in comparison with single-phase cooling. The results show that the large internal pressure and the pumping pressure drop are significant limiting factors, along with significant mass flow rate maldistribution due to the presence of hot-spots. Nevertheless, two-phase cooling using R123 and R245ca refrigerants yields superior performance to single-phase cooling for the hot-spot fluxes approaching ~300 W/cm2. In general, a hybrid cooling scheme with a dedicated approach to the hot-spot thermal management should greatly improve the two-phase cooling system performance and reliability by enabling a cooling-load-matched thermal design and by suppressing the mass flow rate maldistribution within the cooling layer. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...] [article] Thermal characterization of interlayer microfluidic cooling of three-dimensional integrated circuits with nonuniform heat flux [texte imprimé] / Yoon Jo Kim, Auteur ; Yogendra K. Joshi, Auteur ; Andrei G. Fedorov, Auteur . - pp. [041009-1/9]. Physique Langues : Anglais (eng) in Journal of heat transfer > Vol. 132 N° 4 (n° spécial) (Avril 2010) . - pp. [041009-1/9] Mots-clés : Microchannel  Microfluidic  cooling  Three-dimensional  IC  Nonuniform  heat  flux  Single-phase  Two-phase  Pressure  drop Index. décimale : 536 Chaleur. Thermodynamique Résumé : It is now widely recognized that the three-dimensional (3D) system integration is a key enabling technology to achieve the performance needs of future microprocessor integrated circuits (ICs). To provide modular thermal management in 3D-stacked ICs, the interlayer microfluidic cooling scheme is adopted and analyzed in this study focusing on a single cooling layer performance. The effects of cooling mode (single-phase versus phase-change) and stack/layer geometry on thermal management performance are quantitatively analyzed, and implications on the through-silicon-via scaling and electrical interconnect congestion are discussed. Also, the thermal and hydraulic performance of several two-phase refrigerants is discussed in comparison with single-phase cooling. The results show that the large internal pressure and the pumping pressure drop are significant limiting factors, along with significant mass flow rate maldistribution due to the presence of hot-spots. Nevertheless, two-phase cooling using R123 and R245ca refrigerants yields superior performance to single-phase cooling for the hot-spot fluxes approaching ~300 W/cm2. In general, a hybrid cooling scheme with a dedicated approach to the hot-spot thermal management should greatly improve the two-phase cooling system performance and reliability by enabling a cooling-load-matched thermal design and by suppressing the mass flow rate maldistribution within the cooling layer. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...]