Article : texte imprimé

Thermal characterization of interlayer microfluidic cooling of three-dimensional integrated circuits with nonuniform heat flux

Yoon Jo Kim, Auteur ; Yogendra K. Joshi, Auteur ; Andrei G. Fedorov, Auteur |

Dans Journal of heat transfer (Vol. 132 N° 4 (n° spécial), Avril 2010)

It is now widely recognized that the three-dimensional (3D) system integration is a key enabling technology to achieve the performance needs of future microprocessor integrated circuits (ICs). To provide modular thermal management in 3D-stacked [...]

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