Equipment design and control of advanced thermal-processing module in lithography / Tay, Arthur in IEEE transactions on industrial electronics, Vol. 57 N° 3 (Mars 2010)  

Public ISBD [article]  inIEEE transactions on industrial electronics > Vol. 57 N° 3 (Mars 2010) . - pp. 1112 - 1119 Titre : Equipment design and control of advanced thermal-processing module in lithography Type de document : texte imprimé Auteurs : Tay, Arthur, Auteur ; Chua, Hui Tong, Auteur ; Wang, Yuheng, Auteur Article en page(s) : pp. 1112 - 1119 Note générale : Génie électrique Langues : Anglais (eng) Mots-clés : Lithography Temperature control Thermal cycling Thermoelectric Index. décimale : 621.38 Dispositifs électroniques. Tubes à électrons. Photocellules. Accélérateurs de particules. Tubes à rayons X Résumé : A programmable multizone thermal-processing module is developed to achieve wafer-temperature uniformity during the thermal-cycling process in lithography. The bake and chill steps are conducted sequentially within the same module without any substrate movement. An array of thermoelectric devices (TEDs) is used to provide a distributed heating to the substrate for uniformity and transient temperature control. The TEDs also provide active cooling for chilling the substrate to a temperature suitable for subsequent processing steps. This design is an improvement of a previous work, eliminating the need of a mica heater. The system is designed via detailed modeling and simulations based on first-principle heat-transfer analysis. Experimental results on the prototype demonstrate about ±0.4°C spatial uniformity during the entire thermal cycle. DEWEY : 621.38 ISSN : 0278-0046 En ligne : http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5153311 [article] Equipment design and control of advanced thermal-processing module in lithography [texte imprimé] / Tay, Arthur, Auteur ; Chua, Hui Tong, Auteur ; Wang, Yuheng, Auteur . - pp. 1112 - 1119. Génie électrique Langues : Anglais (eng) in IEEE transactions on industrial electronics > Vol. 57 N° 3 (Mars 2010) . - pp. 1112 - 1119 Mots-clés : Lithography Temperature control Thermal cycling Thermoelectric Index. décimale : 621.38 Dispositifs électroniques. Tubes à électrons. Photocellules. Accélérateurs de particules. Tubes à rayons X Résumé : A programmable multizone thermal-processing module is developed to achieve wafer-temperature uniformity during the thermal-cycling process in lithography. The bake and chill steps are conducted sequentially within the same module without any substrate movement. An array of thermoelectric devices (TEDs) is used to provide a distributed heating to the substrate for uniformity and transient temperature control. The TEDs also provide active cooling for chilling the substrate to a temperature suitable for subsequent processing steps. This design is an improvement of a previous work, eliminating the need of a mica heater. The system is designed via detailed modeling and simulations based on first-principle heat-transfer analysis. Experimental results on the prototype demonstrate about ±0.4°C spatial uniformity during the entire thermal cycle. DEWEY : 621.38 ISSN : 0278-0046 En ligne : http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5153311

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Predictive ratio control for interacting processes / Tan, Kok Kiong in Industrial & engineering chemistry research, Vol. 48 N° 23 (Décembre 2009)  

Public ISBD [article]  inIndustrial & engineering chemistry research > Vol. 48 N° 23 (Décembre 2009) . - pp. 10515–10521 Titre : Predictive ratio control for interacting processes Type de document : texte imprimé Auteurs : Tan, Kok Kiong, Auteur ; Tay, Arthur, Auteur ; Zhao Shao, Auteur Année de publication : 2010 Article en page(s) : pp. 10515–10521 Note générale : Industrial chemistry Langues : Anglais (eng) Mots-clés : Predictive--Ratio--Control--Interacting--Processes Résumé : In this paper, a predictive-PID ratio control scheme is developed for multivariable processes. The Generalized predictive control based PID configuration is incorporated into various conventional ratio control schemes. Conventional parallel and series ratio control cannot satisfy the stringent requirements. The proposed method is applied to the wafer temperature uniformity control in the lithography. Both simulation and experimental results show the effectiveness of the proposed predictive ratio control method. ISSN : 0888-5885 En ligne : http://pubs.acs.org/doi/abs/10.1021/ie900219u [article] Predictive ratio control for interacting processes [texte imprimé] / Tan, Kok Kiong, Auteur ; Tay, Arthur, Auteur ; Zhao Shao, Auteur . - 2010 . - pp. 10515–10521. Industrial chemistry Langues : Anglais (eng) in Industrial & engineering chemistry research > Vol. 48 N° 23 (Décembre 2009) . - pp. 10515–10521 Mots-clés : Predictive--Ratio--Control--Interacting--Processes Résumé : In this paper, a predictive-PID ratio control scheme is developed for multivariable processes. The Generalized predictive control based PID configuration is incorporated into various conventional ratio control schemes. Conventional parallel and series ratio control cannot satisfy the stringent requirements. The proposed method is applied to the wafer temperature uniformity control in the lithography. Both simulation and experimental results show the effectiveness of the proposed predictive ratio control method. ISSN : 0888-5885 En ligne : http://pubs.acs.org/doi/abs/10.1021/ie900219u

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