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Equipment design and control of advanced thermal-processing module in lithography / Tay, Arthur in IEEE transactions on industrial electronics, Vol. 57 N° 3 (Mars 2010) 

Public ISBD [article]  in IEEE transactions on industrial electronics > Vol. 57 N° 3 (Mars 2010) . - pp. 1112 - 1119 Titre : Equipment design and control of advanced thermal-processing module in lithography Type de document : texte imprimé Auteurs : Tay, Arthur, Auteur ; Chua, Hui Tong, Auteur ; Wang, Yuheng, Auteur Article en page(s) : pp. 1112 - 1119 Note générale : Génie électrique Langues : Anglais (eng) Mots-clés : Lithography  Temperature  control  Thermal  cycling  Thermoelectric Index. décimale : 621.38 Dispositifs électroniques. Tubes à électrons. Photocellules. Accélérateurs de particules. Tubes à rayons X Résumé : A programmable multizone thermal-processing module is developed to achieve wafer-temperature uniformity during the thermal-cycling process in lithography. The bake and chill steps are conducted sequentially within the same module without any substrate movement. An array of thermoelectric devices (TEDs) is used to provide a distributed heating to the substrate for uniformity and transient temperature control. The TEDs also provide active cooling for chilling the substrate to a temperature suitable for subsequent processing steps. This design is an improvement of a previous work, eliminating the need of a mica heater. The system is designed via detailed modeling and simulations based on first-principle heat-transfer analysis. Experimental results on the prototype demonstrate about ±0.4°C spatial uniformity during the entire thermal cycle. DEWEY : 621.38 ISSN : 0278-0046 En ligne : http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5153311 [article] Equipment design and control of advanced thermal-processing module in lithography [texte imprimé] / Tay, Arthur, Auteur ; Chua, Hui Tong, Auteur ; Wang, Yuheng, Auteur . - pp. 1112 - 1119. Génie électrique Langues : Anglais (eng) in IEEE transactions on industrial electronics > Vol. 57 N° 3 (Mars 2010) . - pp. 1112 - 1119 Mots-clés : Lithography  Temperature  control  Thermal  cycling  Thermoelectric Index. décimale : 621.38 Dispositifs électroniques. Tubes à électrons. Photocellules. Accélérateurs de particules. Tubes à rayons X Résumé : A programmable multizone thermal-processing module is developed to achieve wafer-temperature uniformity during the thermal-cycling process in lithography. The bake and chill steps are conducted sequentially within the same module without any substrate movement. An array of thermoelectric devices (TEDs) is used to provide a distributed heating to the substrate for uniformity and transient temperature control. The TEDs also provide active cooling for chilling the substrate to a temperature suitable for subsequent processing steps. This design is an improvement of a previous work, eliminating the need of a mica heater. The system is designed via detailed modeling and simulations based on first-principle heat-transfer analysis. Experimental results on the prototype demonstrate about ±0.4°C spatial uniformity during the entire thermal cycle. DEWEY : 621.38 ISSN : 0278-0046 En ligne : http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5153311