Measurement of the heat capacity of copper thin films using a micropulse calorimeter / Yu, Jun in Journal of heat transfer, Vol. 132 N° 1 (Janvier 2010)  

Public ISBD [article]  inJournal of heat transfer > Vol. 132 N° 1 (Janvier 2010) . - pp. [012403-1/6] Titre : Measurement of the heat capacity of copper thin films using a micropulse calorimeter Type de document : texte imprimé Auteurs : Yu, Jun, Auteur ; Zhen'an Tang, Auteur ; Fengtian Zhang, Auteur Article en page(s) : pp. [012403-1/6] Note générale : Physique Langues : Anglais (eng) Mots-clés : Micro-/nanoscale heat transfer Thin film Heat capacity Thermal characterization Index. décimale : 536 Chaleur. Thermodynamique Résumé : This paper presents a micropulse calorimeter for heat capacity measurement of thin films. Optimization of the structure and data processing methods of the microcalorimeter improved the thermal isolation and temperature uniformity and reduced the heat capacity measurement errors. Heat capacities of copper thin films with thicknesses from 20 nm to 340 nm are measured in the temperature range from 300 K to 420 K in vacuum of 1 mPa. The specific heat of the 340 nm Cu film is close to the literature data of bulk Cu. For the thinner films, the data shows that the specific heat increases with the decreasing of film thickness (or the average crystalline size). DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...] [article] Measurement of the heat capacity of copper thin films using a micropulse calorimeter [texte imprimé] / Yu, Jun, Auteur ; Zhen'an Tang, Auteur ; Fengtian Zhang, Auteur . - pp. [012403-1/6]. Physique Langues : Anglais (eng) in Journal of heat transfer > Vol. 132 N° 1 (Janvier 2010) . - pp. [012403-1/6] Mots-clés : Micro-/nanoscale heat transfer Thin film Heat capacity Thermal characterization Index. décimale : 536 Chaleur. Thermodynamique Résumé : This paper presents a micropulse calorimeter for heat capacity measurement of thin films. Optimization of the structure and data processing methods of the microcalorimeter improved the thermal isolation and temperature uniformity and reduced the heat capacity measurement errors. Heat capacities of copper thin films with thicknesses from 20 nm to 340 nm are measured in the temperature range from 300 K to 420 K in vacuum of 1 mPa. The specific heat of the 340 nm Cu film is close to the literature data of bulk Cu. For the thinner films, the data shows that the specific heat increases with the decreasing of film thickness (or the average crystalline size). DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...]

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