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An experimental study to show the effect of thermal stress on thermal contact conductance at sub-megapascal contact pressures / Prashant Misra in Journal of heat transfer, Vol. 132 N° 9 (Septembre 2010) 

Public ISBD [article]  in Journal of heat transfer > Vol. 132 N° 9 (Septembre 2010) . - pp. [094501-1/4] Titre : An experimental study to show the effect of thermal stress on thermal contact conductance at sub-megapascal contact pressures Type de document : texte imprimé Auteurs : Prashant Misra, Auteur ; J. Nagaraju, Auteur Article en page(s) : pp. [094501-1/4] Note générale : Physique Langues : Anglais (eng) Mots-clés : OFHC  Cu  Thermal  contact  conductance  Thermal  stress  Load  correction  factor Index. décimale : 536 Chaleur. Thermodynamique Résumé : Experimental studies are presented to show the effect of thermal stresses on thermal contact conductance (TCC) at low contact pressures. It is observed that in a closed contact assembly, contact pressure acting on the interface changes with the changing temperature of contact members. This change in contact pressure consequently causes variations in the TCC of the junction. A relationship between temperature change and the corresponding magnitude of developed thermal stress in a contact assembly is determined experimentally. Inclusion of a term called temperature dependent load correction factor is suggested in the theoretical model for TCC to make it capable of predicting TCC values more accurately in contact assemblies that experience large temperature fluctuations. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...] [article] An experimental study to show the effect of thermal stress on thermal contact conductance at sub-megapascal contact pressures [texte imprimé] / Prashant Misra, Auteur ; J. Nagaraju, Auteur . - pp. [094501-1/4]. Physique Langues : Anglais (eng) in Journal of heat transfer > Vol. 132 N° 9 (Septembre 2010) . - pp. [094501-1/4] Mots-clés : OFHC  Cu  Thermal  contact  conductance  Thermal  stress  Load  correction  factor Index. décimale : 536 Chaleur. Thermodynamique Résumé : Experimental studies are presented to show the effect of thermal stresses on thermal contact conductance (TCC) at low contact pressures. It is observed that in a closed contact assembly, contact pressure acting on the interface changes with the changing temperature of contact members. This change in contact pressure consequently causes variations in the TCC of the junction. A relationship between temperature change and the corresponding magnitude of developed thermal stress in a contact assembly is determined experimentally. Inclusion of a term called temperature dependent load correction factor is suggested in the theoretical model for TCC to make it capable of predicting TCC values more accurately in contact assemblies that experience large temperature fluctuations. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...]