| Titre : | Thermal management of on-chip hot spot (2012) |
| Auteurs : | Avram Bar-Cohen, Auteur ; Peng Wang, Auteur |
| Type de document : | Article : texte imprimé |
| Dans : | Journal of heat transfer (Vol. 134 N° 5, Mai 2012) |
| Article en page(s) : | 11 p. |
| Note générale : | heat transfer |
| Langues : | Anglais |
| Index. décimale : | 536 (Chaleur. Thermodynamique) |
| Tags : | hot spot ; electronics cooling ; thermoelectric cooler ; two-phase ; micrograp cooler |
| Résumé : | The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in microprocessor chip heat flux and growing concern over the emergence of on-chip hot spots. The application of on-chip high flux cooling techniques is today a primary driver for innovation in the electronics industry. In this paper, the physical phenomena underpinning the most promising on-chip thermal management approaches for hot spot remediation, along with basic modeling equations and typical results are described. Attention is devoted to thermoelectric micro-coolers and two-phase microgap coolers. The advantages and disadvantages of these on-chip cooling solutions for high heat flux hot spots are evaluated and compared. |
| DEWEY : | 536 |
| ISSN : | 0022-1481 |
| En ligne : | http://asmedl.org/getabs/servlet/GetabsServlet?prog=normal&id=JHTRAO000134000005051017000001&idtype=cvips&gifs=Yes&ref=no |
