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Détail de l'auteur
Auteur S. S. Feng
Documents disponibles écrits par cet auteur
Affiner la rechercheA Semi-empirical heat transfer model for forced convection in pin-fin heat sinks subjected to nonuniform heating / S. S. Feng in Journal of heat transfer, Vol. 132 N° 12 (Décembre 2010)
[article]
in Journal of heat transfer > Vol. 132 N° 12 (Décembre 2010) . - pp. [121702-1/11]
Titre : A Semi-empirical heat transfer model for forced convection in pin-fin heat sinks subjected to nonuniform heating Type de document : texte imprimé Auteurs : S. S. Feng, Auteur ; T. Kim, Auteur ; T. J. Lu, Auteur Année de publication : 2010 Article en page(s) : pp. [121702-1/11] Note générale : Physique Langues : Anglais (eng) Mots-clés : Fuite volume method Heat spreading Nonuniform heating Pin-fin heat sink Index. décimale : 536 Chaleur. Thermodynamique Résumé : This paper presents a cost effective semi-empirical analytical model for convective heat transfer in pin-fin heat sinks subjected to nonuniform heating set by a circular hot gas impinging jet. Based on empirical correlations taken from the open literature, temperature variations in the heat sink are obtained from the finite volume solution of the semi-empirical model. Based on a purpose-built experimental setup, measurements of a substrate temperature are performed using an infrared camera. These, along with the convective fluid temperature measured at the exit of the pin-fin array, are compared against analytical model predictions, with overall good agreement achieved. Subsequently, the influences of the convection Reynolds number, substrate thickness, and thermal conductivity of material on the distribution of substrate temperature are quantified by the validated model. It is demonstrated that the present model is capable of predicting local thermal behaviors such as the footprints of the pin fins. In addition, with the spreading resistance captured accurately, the model can be used for the design optimization of pin-fin/substrate systems subjected to nonuniform heating.
DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...] [article] A Semi-empirical heat transfer model for forced convection in pin-fin heat sinks subjected to nonuniform heating [texte imprimé] / S. S. Feng, Auteur ; T. Kim, Auteur ; T. J. Lu, Auteur . - 2010 . - pp. [121702-1/11].
Physique
Langues : Anglais (eng)
in Journal of heat transfer > Vol. 132 N° 12 (Décembre 2010) . - pp. [121702-1/11]
Mots-clés : Fuite volume method Heat spreading Nonuniform heating Pin-fin heat sink Index. décimale : 536 Chaleur. Thermodynamique Résumé : This paper presents a cost effective semi-empirical analytical model for convective heat transfer in pin-fin heat sinks subjected to nonuniform heating set by a circular hot gas impinging jet. Based on empirical correlations taken from the open literature, temperature variations in the heat sink are obtained from the finite volume solution of the semi-empirical model. Based on a purpose-built experimental setup, measurements of a substrate temperature are performed using an infrared camera. These, along with the convective fluid temperature measured at the exit of the pin-fin array, are compared against analytical model predictions, with overall good agreement achieved. Subsequently, the influences of the convection Reynolds number, substrate thickness, and thermal conductivity of material on the distribution of substrate temperature are quantified by the validated model. It is demonstrated that the present model is capable of predicting local thermal behaviors such as the footprints of the pin fins. In addition, with the spreading resistance captured accurately, the model can be used for the design optimization of pin-fin/substrate systems subjected to nonuniform heating.
DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...] Transient thermal response of pin-fin sandwich panels to hot jet impingement / S. S. Feng in Journal of heat transfer, Vol. 133 N° 6 (Juin 2011)
[article]
in Journal of heat transfer > Vol. 133 N° 6 (Juin 2011) . - pp. [061901/1-11]
Titre : Transient thermal response of pin-fin sandwich panels to hot jet impingement Type de document : texte imprimé Auteurs : S. S. Feng, Auteur ; T. J. Lu, Auteur ; T. Kim, Auteur Année de publication : 2011 Article en page(s) : pp. [061901/1-11] Note générale : Physique Langues : Anglais (eng) Mots-clés : Nonuniform thermal load Cyclic heating Forced convection Pin-fin Sandwich panel Transient thermal response Index. décimale : 536 Chaleur. Thermodynamique Résumé : The transient thermal response of a sandwich panel with pin-fin core subjected to nonuniform impinging jet heating was investigated theoretically and experimentally. Forced convection flow passing through the sandwich channel was employed to remove heat imposed nonuniformly on the pin-fin sandwich. A semi-empirical model was developed to predict the transient thermal fields in the front and back facesheets of the sandwich, in the pin-fins, and in the forced convective flow. Transient heat transfer measurements were conducted to validate the model with hot air impinging jet heating. The temperature history of the sandwich was predicted under two different boundary conditions: (1) continuous and (2) cyclic heating from a flame impinging jet. Heating by the flame impinging jet was modeled by prescribing heat flux distribution expressed with an exponential function. For continuous heating, systematic parametrical studies were carried out to examine the effects of convection Reynolds number, fin pitch, fin thickness, and facesheet thickness on the maximum facesheet temperature. For cyclic heating, the thermal performance of the sandwich as a function of heat flux intensity was quantified. It was demonstrated that pin-fin sandwiches are capable of thermally managing nonuniformly distributed heat fluxes having high intensities, either continuously or cyclically imposed.
DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...] [article] Transient thermal response of pin-fin sandwich panels to hot jet impingement [texte imprimé] / S. S. Feng, Auteur ; T. J. Lu, Auteur ; T. Kim, Auteur . - 2011 . - pp. [061901/1-11].
Physique
Langues : Anglais (eng)
in Journal of heat transfer > Vol. 133 N° 6 (Juin 2011) . - pp. [061901/1-11]
Mots-clés : Nonuniform thermal load Cyclic heating Forced convection Pin-fin Sandwich panel Transient thermal response Index. décimale : 536 Chaleur. Thermodynamique Résumé : The transient thermal response of a sandwich panel with pin-fin core subjected to nonuniform impinging jet heating was investigated theoretically and experimentally. Forced convection flow passing through the sandwich channel was employed to remove heat imposed nonuniformly on the pin-fin sandwich. A semi-empirical model was developed to predict the transient thermal fields in the front and back facesheets of the sandwich, in the pin-fins, and in the forced convective flow. Transient heat transfer measurements were conducted to validate the model with hot air impinging jet heating. The temperature history of the sandwich was predicted under two different boundary conditions: (1) continuous and (2) cyclic heating from a flame impinging jet. Heating by the flame impinging jet was modeled by prescribing heat flux distribution expressed with an exponential function. For continuous heating, systematic parametrical studies were carried out to examine the effects of convection Reynolds number, fin pitch, fin thickness, and facesheet thickness on the maximum facesheet temperature. For cyclic heating, the thermal performance of the sandwich as a function of heat flux intensity was quantified. It was demonstrated that pin-fin sandwiches are capable of thermally managing nonuniformly distributed heat fluxes having high intensities, either continuously or cyclically imposed.
DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...]