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Pool boiling heat transfer and bubble dynamics over plain and enhanced microchannels / Dwight Cooke in Journal of heat transfer, Vol. 133 N° 5 (Mai 2011) 

Public ISBD [article]  in Journal of heat transfer > Vol. 133 N° 5 (Mai 2011) . - pp. [052902/1-9] Titre : Pool boiling heat transfer and bubble dynamics over plain and enhanced microchannels Type de document : texte imprimé Auteurs : Dwight Cooke, Auteur ; Satish G. Kandlikar, Auteur Année de publication : 2011 Article en page(s) : pp. [052902/1-9] Note générale : Physique Langues : Anglais (eng) Mots-clés : Pool  boiling  Heat  transfer  enhancement  Microchannels  Grooves  Bubble  dynamics Index. décimale : 536 Chaleur. Thermodynamique Résumé : Pool boiling is of interest in high heat flux applications because of its potential for removing large amount of heat resulting from the latent heat of evaporation and little pressure drop penalty for circulating coolant through the system. However, the heat transfer performance of pool boiling systems is not adequate to match the cooling ability provided by enhanced microchannels operating under single-phase conditions. The objective of this work is to evaluate the pool boiling performance of structured surface features etched on a silicon chip. The performance is normalized with respect to a plain chip. This investigation also focuses on the bubble dynamics on plain and structured microchannel surfaces under various heat fluxes in an effort to understand the underlying heat transfer mechanism. It was determined that surface modifications to silicon chips can improve the heat transfer coefficient by a factor up to 3.4 times the performance of a plain chip. Surfaces with microchannels have shown to be efficient for boiling heat transfer by allowing liquid to flow through the open channels and wet the heat transfer surface while vapor is generated. This work is expected to lead to improved enhancement features for extending the pool boiling option to meet the high heat flux removal demands in electronic cooling applications. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...] [article] Pool boiling heat transfer and bubble dynamics over plain and enhanced microchannels [texte imprimé] / Dwight Cooke, Auteur ; Satish G. Kandlikar, Auteur . - 2011 . - pp. [052902/1-9]. Physique Langues : Anglais (eng) in Journal of heat transfer > Vol. 133 N° 5 (Mai 2011) . - pp. [052902/1-9] Mots-clés : Pool  boiling  Heat  transfer  enhancement  Microchannels  Grooves  Bubble  dynamics Index. décimale : 536 Chaleur. Thermodynamique Résumé : Pool boiling is of interest in high heat flux applications because of its potential for removing large amount of heat resulting from the latent heat of evaporation and little pressure drop penalty for circulating coolant through the system. However, the heat transfer performance of pool boiling systems is not adequate to match the cooling ability provided by enhanced microchannels operating under single-phase conditions. The objective of this work is to evaluate the pool boiling performance of structured surface features etched on a silicon chip. The performance is normalized with respect to a plain chip. This investigation also focuses on the bubble dynamics on plain and structured microchannel surfaces under various heat fluxes in an effort to understand the underlying heat transfer mechanism. It was determined that surface modifications to silicon chips can improve the heat transfer coefficient by a factor up to 3.4 times the performance of a plain chip. Surfaces with microchannels have shown to be efficient for boiling heat transfer by allowing liquid to flow through the open channels and wet the heat transfer surface while vapor is generated. This work is expected to lead to improved enhancement features for extending the pool boiling option to meet the high heat flux removal demands in electronic cooling applications. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...]