Response surface methodology for minimizing solder-ball defects in an electronics-assembly process / Chuvej Chansa-ngavej in International journal of management science and engineering management, Vol. 5 N° 2 (Avril 2010)  

Public ISBD [article]  inInternational journal of management science and engineering management > Vol. 5 N° 2 (Avril 2010) . - pp.95-100 Titre : Response surface methodology for minimizing solder-ball defects in an electronics-assembly process Type de document : texte imprimé Auteurs : Chuvej Chansa-ngavej, Auteur ; Jumroon Kasemsomporn, Auteur Année de publication : 2011 Article en page(s) : pp.95-100 Note générale : Management Langues : Anglais (eng) Mots-clés : Response surface methodology Reflow-thermal profile Solder-ball defects Process optimization Résumé : Electronics-assembly companies are always trying to reduce solder-ball defects as their customers keep tightening specification since the solder balls could cause electrical short circuit and damage to the product. The effect of solder ball defects is not only on quality risk, but also on scrap costs. One initiative to overcome this problem is to minimize the spattering of solder while the product is passing through reflow-soldering oven. Reflow soldering is a complex process, which requires specific optimal soldering conditions based on experimental data. The trial-and-error method to determine the optimal conditions would require a prohibitively large number of experiments, however. Therefore, the Response Surface Methodology (RSM) was employed in this research to overcome this problem. The main idea of RSM is to use a set of designed experiments to obtain the optimal response. The second-order model was used here. The ramp-up rate and pre-heat time of reflow-thermal profile were selected as the input variables, and the number of solder-ball defects was the output variable. This research project has resulted in US$1,094 monthly cost savings under the set optimal conditions, which are 1.4 ˚C/s of ramp-up rate and 60 s of pre-heat time. At this rate the project is paid back in less than a month. Apart from the tangible benefit, other intangibles were also gained as lessons learned from the implementation of this methodology could be extended to other products. DEWEY : 658 ISSN : 1750-9653 En ligne : http://www.ijmsem.org/OnlineJournal.do/?121.html [article] Response surface methodology for minimizing solder-ball defects in an electronics-assembly process [texte imprimé] / Chuvej Chansa-ngavej, Auteur ; Jumroon Kasemsomporn, Auteur . - 2011 . - pp.95-100. Management Langues : Anglais (eng) in International journal of management science and engineering management > Vol. 5 N° 2 (Avril 2010) . - pp.95-100 Mots-clés : Response surface methodology Reflow-thermal profile Solder-ball defects Process optimization Résumé : Electronics-assembly companies are always trying to reduce solder-ball defects as their customers keep tightening specification since the solder balls could cause electrical short circuit and damage to the product. The effect of solder ball defects is not only on quality risk, but also on scrap costs. One initiative to overcome this problem is to minimize the spattering of solder while the product is passing through reflow-soldering oven. Reflow soldering is a complex process, which requires specific optimal soldering conditions based on experimental data. The trial-and-error method to determine the optimal conditions would require a prohibitively large number of experiments, however. Therefore, the Response Surface Methodology (RSM) was employed in this research to overcome this problem. The main idea of RSM is to use a set of designed experiments to obtain the optimal response. The second-order model was used here. The ramp-up rate and pre-heat time of reflow-thermal profile were selected as the input variables, and the number of solder-ball defects was the output variable. This research project has resulted in US$1,094 monthly cost savings under the set optimal conditions, which are 1.4 ˚C/s of ramp-up rate and 60 s of pre-heat time. At this rate the project is paid back in less than a month. Apart from the tangible benefit, other intangibles were also gained as lessons learned from the implementation of this methodology could be extended to other products. DEWEY : 658 ISSN : 1750-9653 En ligne : http://www.ijmsem.org/OnlineJournal.do/?121.html

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