Article : texte imprimé

Response surface methodology for minimizing solder-ball defects in an electronics-assembly process

Chuvej Chansa-ngavej, Auteur ; Jumroon Kasemsomporn, Auteur |

Dans International journal of management science and engineering management (Vol. 5 N° 2, Avril 2010)

Electronics-assembly companies are always trying to reduce solder-ball defects as their customers keep tightening specification since the solder balls could cause electrical short circuit and damage to the product. The effect of solder ball de[...]

Plus d'information...

Ajouter un tag

En ligne

---

1 (1 - 1 / 1) Par page : 25 50 100 200