Modeling and validating the transient behavior of flat miniature heat pipes manufactured in multilayer printed circuit board technology / Wessel W. Wits in Journal of heat transfer, Vol. 133 N° 8 (Août 2011)  

Public ISBD [article]  inJournal of heat transfer > Vol. 133 N° 8 (Août 2011) . - pp. [081401/1-10] Titre : Modeling and validating the transient behavior of flat miniature heat pipes manufactured in multilayer printed circuit board technology Type de document : texte imprimé Auteurs : Wessel W. Wits, Auteur ; Jim B. W. Kok, Auteur Année de publication : 2011 Article en page(s) : pp. [081401/1-10] Note générale : Physique Langues : Anglais (eng) Mots-clés : Heat pipe Electronics coolings PCB cooling Thermal management Control volume modeling Index. décimale : 536 Chaleur. Thermodynamique Résumé : A novel, integrated approach in thermal management of electronic products, based on two-phase cooling, is presented. A flat miniature heat pipe, integrated inside the laminated structure of a printed circuit board (PCB), has been developed, based on mainstream PCB multilayer technology. To accurately predict the thermal performance of this two-phase heat transport device and to establish the operational limitations, a numerical model based on control volume elements is discussed. The advantage of this modular approach, compared with, e.g., finite element models, is that the model can be expanded with additional components (e.g., multiple evaporators) very easily. Actual PCBs with several hot spots cooled by flat miniature heat pipes and their parameter effects can be analyzed very quickly, without the necessity of complex and time-consuming finite element analyses. Experimental verification has shown a good comparison with model predictions. Time evolution analyses show that the developed control volume model is well capable of describing the heat pipe transient behavior. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=JHTRAO00013300 [...] [article] Modeling and validating the transient behavior of flat miniature heat pipes manufactured in multilayer printed circuit board technology [texte imprimé] / Wessel W. Wits, Auteur ; Jim B. W. Kok, Auteur . - 2011 . - pp. [081401/1-10]. Physique Langues : Anglais (eng) in Journal of heat transfer > Vol. 133 N° 8 (Août 2011) . - pp. [081401/1-10] Mots-clés : Heat pipe Electronics coolings PCB cooling Thermal management Control volume modeling Index. décimale : 536 Chaleur. Thermodynamique Résumé : A novel, integrated approach in thermal management of electronic products, based on two-phase cooling, is presented. A flat miniature heat pipe, integrated inside the laminated structure of a printed circuit board (PCB), has been developed, based on mainstream PCB multilayer technology. To accurately predict the thermal performance of this two-phase heat transport device and to establish the operational limitations, a numerical model based on control volume elements is discussed. The advantage of this modular approach, compared with, e.g., finite element models, is that the model can be expanded with additional components (e.g., multiple evaporators) very easily. Actual PCBs with several hot spots cooled by flat miniature heat pipes and their parameter effects can be analyzed very quickly, without the necessity of complex and time-consuming finite element analyses. Experimental verification has shown a good comparison with model predictions. Time evolution analyses show that the developed control volume model is well capable of describing the heat pipe transient behavior. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=JHTRAO00013300 [...]

Exemplaires

Code-barres	Cote	Support	Localisation	Section	Disponibilité
aucun exemplaire