| Titre : | In-situ investigation of the surface-topography during anodic dissolution of copper under near-ECM conditions (2012) |
| Auteurs : | M. Schneider, Auteur ; S. Schroth, Auteur ; N. Schubert, Auteur |
| Type de document : | Article : texte imprimé |
| Dans : | Materials and corrosion (Vol. 63 N° 2, Fevrier 2012) |
| Article en page(s) : | pp. 96–104 |
| Note générale : | Génie mécanique |
| Langues : | Anglais |
| Tags : | anodic copper dissolution ; electrochemical machining ; in-situ microscopy |
| Résumé : | Electrochemical machining is characterized by deliberate high speed anodic dissolution. The distance between anode and cathode are only a few hundred microns. Additionally, the electrolyte flow rate is in the range of approximately meter/second. A special electrochemical cell design was developed to investigate the surface topography during the anodic dissolution simultaneously and in-situ under near-ECM conditions. The anode was directly placed under the cathode with a gap of 350 µm. We carried out pulse experiments at 15 A/cm2 and 25 A/cm2 with an electrolyte flow rate of 4m/s. First-time it was possible to observe the surface changing of the anode directly during current pulses by using a video camera. Different stages e.g. roughening, film formation or gas evolution could be distinguished. |
| En ligne : | http://onlinelibrary.wiley.com/doi/10.1002/maco.201005716/abstract |
