| Titre : | Effect of Ag addition on the corrosion properties of Sn-based solder alloys (2010) |
| Auteurs : | Q. V. Bui, Auteur ; N. D. Nam, Auteur ; B.-I. Noh, Auteur |
| Type de document : | Article : texte imprimé |
| Dans : | Materials and corrosion (Vol. 61 N° 1, Janvier 2010) |
| Article en page(s) : | pp. 30-33 |
| Note générale : | Génie mécanique |
| Langues : | Anglais |
| Tags : | Alloy ; corrosion ; intermetallic compounds ; lead free solder ; microstructure |
| Résumé : | Corrosion properties of three different Sn-Ag lead free solder alloys have been investigated in 0.3 wt% Na2SO4 solution as corrosive environment. As cast solder alloy was analyzed by X-ray diffraction (XRD) and scanning electron microscopy (SEM). Volume fractions of the Ag3Sn in the solders were determined by image analysis technique. Pitting potential and corrosion potential for the alloys were determined by potentiodynamic tests. Electrochemical impedance spectroscopy (EIS) was carried out to measure the film and charge transfer resistance. Alloys with lower Ag content have been found as better corrosion resistance material. |
| En ligne : | http://onlinelibrary.wiley.com/doi/10.1002/maco.200905237/abstract |
