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Multiplexed MPC for multizone thermal processing in semiconductor manufacturing / K.V. Ling in IEEE Transactions on control systems technology, Vol. 18 N° 6 (Novembre 2010) 

Public ISBD [article]  in IEEE Transactions on control systems technology > Vol. 18 N° 6 (Novembre 2010) . - pp. 1371-1380 Titre : Multiplexed MPC for multizone thermal processing in semiconductor manufacturing Type de document : texte imprimé Auteurs : K.V. Ling, Auteur ; W.K. Ho, Auteur ; B.F. Wu, Auteur Année de publication : 2011 Article en page(s) : pp. 1371-1380 Note générale : Génie Aérospatial Langues : Anglais (eng) Mots-clés : Feed-forward  Model  predictive  (MPC)  Multiplexed  Process  control  Semiconductor  manufacturing  Temperature  control Index. décimale : 629.1 Résumé : It is known that a faster sampling rate allows a controller to react to unmeasurable disturbances faster. Adding feed- forward could decrease the effect of disturbance significantly, but feedback control is still required to cope with modelling errors and unknown disturbances. A variant of model predictive control (MPC), called multiplexed MPC (MMPC), has been proposed recently. The motivation for MMPC was to reduced real-time computational load and hence allow faster sampling on multivariable systems. In this brief, we report the first successful application of MMPC on a semiconductor manufacturing process. MMPC with feedforward has been demonstrated experimentally on a multizone bake plate application. While most of the temperature drop will be compensated by feedforward control, feedback provided by MMPC will cope with the errors due to warped wafers. This result is important for the semiconductor wafer baking process, because temperature nonuniformity will affect critical dimension of the wafer. DEWEY : 629.1 ISSN : 1063-6536 En ligne : http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5352253 [article] Multiplexed MPC for multizone thermal processing in semiconductor manufacturing [texte imprimé] / K.V. Ling, Auteur ; W.K. Ho, Auteur ; B.F. Wu, Auteur . - 2011 . - pp. 1371-1380. Génie Aérospatial Langues : Anglais (eng) in IEEE Transactions on control systems technology > Vol. 18 N° 6 (Novembre 2010) . - pp. 1371-1380 Mots-clés : Feed-forward  Model  predictive  (MPC)  Multiplexed  Process  control  Semiconductor  manufacturing  Temperature  control Index. décimale : 629.1 Résumé : It is known that a faster sampling rate allows a controller to react to unmeasurable disturbances faster. Adding feed- forward could decrease the effect of disturbance significantly, but feedback control is still required to cope with modelling errors and unknown disturbances. A variant of model predictive control (MPC), called multiplexed MPC (MMPC), has been proposed recently. The motivation for MMPC was to reduced real-time computational load and hence allow faster sampling on multivariable systems. In this brief, we report the first successful application of MMPC on a semiconductor manufacturing process. MMPC with feedforward has been demonstrated experimentally on a multizone bake plate application. While most of the temperature drop will be compensated by feedforward control, feedback provided by MMPC will cope with the errors due to warped wafers. This result is important for the semiconductor wafer baking process, because temperature nonuniformity will affect critical dimension of the wafer. DEWEY : 629.1 ISSN : 1063-6536 En ligne : http://ieeexplore.ieee.org/xpl/freeabs_all.jsp?arnumber=5352253