| Titre : | Anion effect on Cu2+ adsorption on NH2-MCM-41 (2009) |
| Auteurs : | Koon Fung Lam, Auteur ; Xinqing Chen, Auteur ; Gordon McKay, Auteur |
| Type de document : | Article : texte imprimé |
| Dans : | Industrial & engineering chemistry research (Vol. 47 N° 23, Décembre 2008) |
| Article en page(s) : | p. 9376–9383 |
| Note générale : | Chemistry engineering |
| Langues : | Anglais |
| Tags : | Anion affect Cu2+ adsorption NH2-MCM-41 |
| Résumé : | The anion effect was investigated for the copper adsorption on NH2-MCM-41 from Cu(NO3)2 and CuSO4 solutions. The copper adsorption was higher and faster in the presence of SO42− anion compared to NO3−. The MCM-41 possesses well-ordered mesopores that are readily accessible and a uniform surface that is amenable to the attachment of the chemical moieties for creating tailored adsorption sites. The adsorption sites on NH2-MCM-41 were created by grafting aminopropyls on MCM-41, and the random deposition resulted in a site distribution best described by the Freundlich equation. The majority of the adsorption sites (i.e., up to 70%) are readily accessible to Cu2+ adsorption. The remaining sites were only accessible in the presence of SO42−. Evidence showed that the SO42− anion affects the adsorption by interacting with the dissolved copper to form [CuSO4]0 species, coadsorbing with Cu2+ to form stable complexes, and may even indirectly react with the weakly acidic silanol groups to liberate aminopropyls for more Cu2+ adsorption. |
| En ligne : | http://pubs.acs.org/doi/abs/10.1021/ie701748b |
