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Coffee stain ring effect and nonuniform material removal in chemical mechanical polishing / Jianguo Xin in Transactions of the ASME . Journal of tribology, Vol. 132 N° 4 (Octobre 2010) 

Public ISBD [article]  in Transactions of the ASME . Journal of tribology > Vol. 132 N° 4 (Octobre 2010) . - 06 p. Titre : Coffee stain ring effect and nonuniform material removal in chemical mechanical polishing Type de document : texte imprimé Auteurs : Jianguo Xin, Auteur Année de publication : 2011 Article en page(s) : 06 p. Note générale : Tribology Langues : Anglais (eng) Mots-clés : Chemical  mechanical  polishing  Drops  Evaporation  Flow  Solvent  effects Index. décimale : 621.5 Energie pneumatique. Machinerie et outils. Réfrigération Résumé : When a drop of coffee dries on the counter-top, it leaves a dense, ringlike stain along its perimeter. Solids immersed in a drying drop will migrate toward the edge of the drop and form a solid ring. Such phenomena create ringlike stains and happen for a wide variety of surfaces, solvents, and solutes. It is referred to as the coffee stain ring effect. The phenomenon is caused by the outward microfluidic flow of the solute within the drop, which is driven by the evaporation of solvent. We show that the mechanism for the ring effect contributes to the nonuniform material removal in chemical mechanical polishing (CMP), specifically, at edges of blanket wafers causing the edge effect or at edges and corners of protrusive features on patterned wafers inducing the doming effect; metal dishing and dielectric erosion. By controlling the evaporation profile of the solvent in the slurry layer between the wafer surface and the polishing pad, such as making grooves or embedding the abrasive particles on the pad, or delivering the slurry from the bottom of the pad, one can improve the uniformity of material removal during the CMP process. DEWEY : 621.5 ISSN : 0742-4787 En ligne : http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=JOTRE900013 [...] [article] Coffee stain ring effect and nonuniform material removal in chemical mechanical polishing [texte imprimé] / Jianguo Xin, Auteur . - 2011 . - 06 p. Tribology Langues : Anglais (eng) in Transactions of the ASME . Journal of tribology > Vol. 132 N° 4 (Octobre 2010) . - 06 p. Mots-clés : Chemical  mechanical  polishing  Drops  Evaporation  Flow  Solvent  effects Index. décimale : 621.5 Energie pneumatique. Machinerie et outils. Réfrigération Résumé : When a drop of coffee dries on the counter-top, it leaves a dense, ringlike stain along its perimeter. Solids immersed in a drying drop will migrate toward the edge of the drop and form a solid ring. Such phenomena create ringlike stains and happen for a wide variety of surfaces, solvents, and solutes. It is referred to as the coffee stain ring effect. The phenomenon is caused by the outward microfluidic flow of the solute within the drop, which is driven by the evaporation of solvent. We show that the mechanism for the ring effect contributes to the nonuniform material removal in chemical mechanical polishing (CMP), specifically, at edges of blanket wafers causing the edge effect or at edges and corners of protrusive features on patterned wafers inducing the doming effect; metal dishing and dielectric erosion. By controlling the evaporation profile of the solvent in the slurry layer between the wafer surface and the polishing pad, such as making grooves or embedding the abrasive particles on the pad, or delivering the slurry from the bottom of the pad, one can improve the uniformity of material removal during the CMP process. DEWEY : 621.5 ISSN : 0742-4787 En ligne : http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=JOTRE900013 [...]