The effect of film thickness on the failure strain of polymer-supported metal films / Nanshu Lu in Acta materialia, Vol. 58 N° 5 (Mars 2010)  

Public ISBD [article]  inActa materialia > Vol. 58 N° 5 (Mars 2010) . - pp. 1679–1687 Titre : The effect of film thickness on the failure strain of polymer-supported metal films Type de document : texte imprimé Auteurs : Nanshu Lu, Auteur ; Zhigang Suo, Auteur ; Joost J. Vlassak, Auteur Année de publication : 2011 Article en page(s) : pp. 1679–1687 Note générale : Métallurgie Langues : Anglais (eng) Mots-clés : Metal films Failure strain Thickness Yield strength Texture Résumé : We perform uniaxial tensile tests on polyimide-supported copper films with a strong (1 1 1) fiber texture and with thicknesses varying from 50 nm to 1 μm. Films with thicknesses below 200 nm fail by intergranular fracture at elongations of only a few percent. Thicker films rupture by ductile transgranular fracture and local debonding from the substrate. The failure strain for transgranular fracture exhibits a maximum for film thicknesses around 500 nm. The transgranular failure mechanism is elucidated by performing finite element simulations that incorporate a cohesive zone along the film/substrate interface. As the film thickness increases from 200 to 500 nm, a decrease in the yield stress of the film makes it more difficult for the film to debond from the substrate, thus increasing the failure strain. As the thickness increases beyond 500 nm, however, the fraction of (1 0 0) grains in the (1 1 1)-textured films increases. On deformation, necking and debonding initiate at the (1 0 0) grains, leading to a reduction in the failure strain of the films. DEWEY : 669 ISSN : 1359-6454 En ligne : http://www.sciencedirect.com/science/article/pii/S135964540900785X [article] The effect of film thickness on the failure strain of polymer-supported metal films [texte imprimé] / Nanshu Lu, Auteur ; Zhigang Suo, Auteur ; Joost J. Vlassak, Auteur . - 2011 . - pp. 1679–1687. Métallurgie Langues : Anglais (eng) in Acta materialia > Vol. 58 N° 5 (Mars 2010) . - pp. 1679–1687 Mots-clés : Metal films Failure strain Thickness Yield strength Texture Résumé : We perform uniaxial tensile tests on polyimide-supported copper films with a strong (1 1 1) fiber texture and with thicknesses varying from 50 nm to 1 μm. Films with thicknesses below 200 nm fail by intergranular fracture at elongations of only a few percent. Thicker films rupture by ductile transgranular fracture and local debonding from the substrate. The failure strain for transgranular fracture exhibits a maximum for film thicknesses around 500 nm. The transgranular failure mechanism is elucidated by performing finite element simulations that incorporate a cohesive zone along the film/substrate interface. As the film thickness increases from 200 to 500 nm, a decrease in the yield stress of the film makes it more difficult for the film to debond from the substrate, thus increasing the failure strain. As the thickness increases beyond 500 nm, however, the fraction of (1 0 0) grains in the (1 1 1)-textured films increases. On deformation, necking and debonding initiate at the (1 0 0) grains, leading to a reduction in the failure strain of the films. DEWEY : 669 ISSN : 1359-6454 En ligne : http://www.sciencedirect.com/science/article/pii/S135964540900785X

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