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Studies on recrystallization of single-phase copper alloys by resistance measurements / J. Freudenberger in Acta materialia, Vol. 58 N° 7 (Avril 2010) 

Public ISBD [article]  in Acta materialia > Vol. 58 N° 7 (Avril 2010) . - pp. 2324–2329 Titre : Studies on recrystallization of single-phase copper alloys by resistance measurements Type de document : texte imprimé Auteurs : J. Freudenberger, Auteur ; A. Kauffmann, Auteur ; H. Klauß, Auteur Année de publication : 2011 Article en page(s) : pp. 2324–2329 Note générale : Métallurgie Langues : Anglais (eng) Mots-clés : Recrystallization  Copper  alloys  Low  temperature  deformation Résumé : Copper-based solid solutions with different contents of solute elements (Zn, Al, Ga, Sn, Ge) were deformed at room temperature and at liquid nitrogen temperature. The recrystallization behaviour of these alloys has been investigated by means of dynamic and isothermal measurements of the resistivity (ρ). Variations of dρ/dT from View the MathML source are interpreted in terms of changes in defect densities by recovery and recrystallization. Deviations from a linear temperature dependence of the resistivity increase with increasing solute concentration. This deviation (i.e. Δρrec as determined at room temperature) also depends on the stacking fault energy γ. We observe a 1/γ2-dependency of Δρrec which is also influenced by the deformation temperature. During deformation, γ controls the possibility of storing deformation energy in the form of dislocations and deformation twins. In combination with the general trend of alloying elements to shift recrystallization to higher temperatures, the recrystallization behaviour of single-phase copper alloys has been described qualitatively. DEWEY : 669 ISSN : 1359-6454 En ligne : http://www.sciencedirect.com/science/article/pii/S135964540900860X [article] Studies on recrystallization of single-phase copper alloys by resistance measurements [texte imprimé] / J. Freudenberger, Auteur ; A. Kauffmann, Auteur ; H. Klauß, Auteur . - 2011 . - pp. 2324–2329. Métallurgie Langues : Anglais (eng) in Acta materialia > Vol. 58 N° 7 (Avril 2010) . - pp. 2324–2329 Mots-clés : Recrystallization  Copper  alloys  Low  temperature  deformation Résumé : Copper-based solid solutions with different contents of solute elements (Zn, Al, Ga, Sn, Ge) were deformed at room temperature and at liquid nitrogen temperature. The recrystallization behaviour of these alloys has been investigated by means of dynamic and isothermal measurements of the resistivity (ρ). Variations of dρ/dT from View the MathML source are interpreted in terms of changes in defect densities by recovery and recrystallization. Deviations from a linear temperature dependence of the resistivity increase with increasing solute concentration. This deviation (i.e. Δρrec as determined at room temperature) also depends on the stacking fault energy γ. We observe a 1/γ2-dependency of Δρrec which is also influenced by the deformation temperature. During deformation, γ controls the possibility of storing deformation energy in the form of dislocations and deformation twins. In combination with the general trend of alloying elements to shift recrystallization to higher temperatures, the recrystallization behaviour of single-phase copper alloys has been described qualitatively. DEWEY : 669 ISSN : 1359-6454 En ligne : http://www.sciencedirect.com/science/article/pii/S135964540900860X