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Scaling the response of microscale compression molding of elemental Cu in the presence of dynamic recrystallization / Fanghua Mei in Acta materialia, Vol. 58 N° 7 (Avril 2010) 

Public ISBD [article]  in Acta materialia > Vol. 58 N° 7 (Avril 2010) . - pp. 2638–2645 Titre : Scaling the response of microscale compression molding of elemental Cu in the presence of dynamic recrystallization Type de document : texte imprimé Auteurs : Fanghua Mei, Auteur ; Ke Chen, Auteur ; J. Jiang, Auteur Année de publication : 2011 Article en page(s) : pp. 2638–2645 Note générale : Métallurgie Langues : Anglais (eng) Mots-clés : Compression  test  Copper  High-temperature  deformation  Dynamic  recrystallization  Molding Résumé : Replication of metallic high-aspect-ratio microscale structures by direct compression molding is a promising microfabrication technique. In this paper, the micromolding response of elemental Cu is measured as a function of molding temperature. Companion tensile testing of macroscale Cu specimens was carried out at the corresponding molding temperatures. Microstructures of tensile tested macroscale Cu specimens and molded Cu specimens were characterized by combining focused ion beam (FIB) sectioning and imaging with ion-induced secondary electrons (ISEs). At all temperatures tested, measured tensile stress–strain curves for Cu show clear evidence for the occurrence of dynamic recrystallization (DRX) within macroscale tensile specimens. Additional FIB sectioning and imaging with ISEs of molded Cu specimens provide microstructural evidence for the occurrence of DRX during molding. The present results show that, even in the presence of DRX, an appropriate one-parameter scaling continues to reduce the molding response to a universal function independent of the molding temperature. DEWEY : 669 ISSN : 1359-6454 En ligne : http://www.sciencedirect.com/science/article/pii/S1359645409009082 [article] Scaling the response of microscale compression molding of elemental Cu in the presence of dynamic recrystallization [texte imprimé] / Fanghua Mei, Auteur ; Ke Chen, Auteur ; J. Jiang, Auteur . - 2011 . - pp. 2638–2645. Métallurgie Langues : Anglais (eng) in Acta materialia > Vol. 58 N° 7 (Avril 2010) . - pp. 2638–2645 Mots-clés : Compression  test  Copper  High-temperature  deformation  Dynamic  recrystallization  Molding Résumé : Replication of metallic high-aspect-ratio microscale structures by direct compression molding is a promising microfabrication technique. In this paper, the micromolding response of elemental Cu is measured as a function of molding temperature. Companion tensile testing of macroscale Cu specimens was carried out at the corresponding molding temperatures. Microstructures of tensile tested macroscale Cu specimens and molded Cu specimens were characterized by combining focused ion beam (FIB) sectioning and imaging with ion-induced secondary electrons (ISEs). At all temperatures tested, measured tensile stress–strain curves for Cu show clear evidence for the occurrence of dynamic recrystallization (DRX) within macroscale tensile specimens. Additional FIB sectioning and imaging with ISEs of molded Cu specimens provide microstructural evidence for the occurrence of DRX during molding. The present results show that, even in the presence of DRX, an appropriate one-parameter scaling continues to reduce the molding response to a universal function independent of the molding temperature. DEWEY : 669 ISSN : 1359-6454 En ligne : http://www.sciencedirect.com/science/article/pii/S1359645409009082