Auteur Dietmar Baither
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Jens Görlich, Auteur ; Dietmar Baither, Auteur ; Guido Schmitz, Auteur |Soldering between solid Ni and liquid Sn is studied, including late stages of reflow. Only during the very early stages of the process, intermetallic grains grow with a 1/3 power dependence on time. Later, kinetics clearly changes to parabolic g[...]
