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Reaction kinetics of Ni/Sn soldering reaction / Jens Görlich in Acta materialia, Vol. 58 N° 9 (Mai 2010) 

Public ISBD [article]  in Acta materialia > Vol. 58 N° 9 (Mai 2010) . - pp. 3187–3197 Titre : Reaction kinetics of Ni/Sn soldering reaction Type de document : texte imprimé Auteurs : Jens Görlich, Auteur ; Dietmar Baither, Auteur ; Guido Schmitz, Auteur Année de publication : 2011 Article en page(s) : pp. 3187–3197 Note générale : Métallurgie Langues : Anglais (eng) Mots-clés : Phase  transformation  Soldering  reaction  Grain  boundary  diffusion  Grain  boundary  wetting  Intermetallic  compounds Résumé : Soldering between solid Ni and liquid Sn is studied, including late stages of reflow. Only during the very early stages of the process, intermetallic grains grow with a 1/3 power dependence on time. Later, kinetics clearly changes to parabolic growth, but remarkably in two subsequent regimes distinguished by different rate constants. The observed kinetics is discussed with respect to recent flux-driven ripening theory. This theory is only valid, if at all, for short reflows up to about 4 min. Transmission electron microscopy reveals the predicted scallop-like microstructure only at the very beginning. A sponge-like structure of equiaxed grains then develops, triggered by permanent nucleation of new grains at the Ni/Ni3Sn4 interface. Wetting of grain boundaries appears only up to a certain depth in the reaction zone. This remarkable behavior is explained by thermodynamic arguments. DEWEY : 669 ISSN : 1359-6454 En ligne : http://www.sciencedirect.com/science/article/pii/S1359645410000418 [article] Reaction kinetics of Ni/Sn soldering reaction [texte imprimé] / Jens Görlich, Auteur ; Dietmar Baither, Auteur ; Guido Schmitz, Auteur . - 2011 . - pp. 3187–3197. Métallurgie Langues : Anglais (eng) in Acta materialia > Vol. 58 N° 9 (Mai 2010) . - pp. 3187–3197 Mots-clés : Phase  transformation  Soldering  reaction  Grain  boundary  diffusion  Grain  boundary  wetting  Intermetallic  compounds Résumé : Soldering between solid Ni and liquid Sn is studied, including late stages of reflow. Only during the very early stages of the process, intermetallic grains grow with a 1/3 power dependence on time. Later, kinetics clearly changes to parabolic growth, but remarkably in two subsequent regimes distinguished by different rate constants. The observed kinetics is discussed with respect to recent flux-driven ripening theory. This theory is only valid, if at all, for short reflows up to about 4 min. Transmission electron microscopy reveals the predicted scallop-like microstructure only at the very beginning. A sponge-like structure of equiaxed grains then develops, triggered by permanent nucleation of new grains at the Ni/Ni3Sn4 interface. Wetting of grain boundaries appears only up to a certain depth in the reaction zone. This remarkable behavior is explained by thermodynamic arguments. DEWEY : 669 ISSN : 1359-6454 En ligne : http://www.sciencedirect.com/science/article/pii/S1359645410000418