Documents disponibles écrits par cet auteur

Sputter-deposited Cu/Cu(O) multilayers exhibiting enhanced strength and tunable modulus / J. P. Chu in Acta materialia, Vol. 58 N° 19 (Novembre 2010) 

Public ISBD [article]  in Acta materialia > Vol. 58 N° 19 (Novembre 2010) . - pp. 6371–6378 Titre : Sputter-deposited Cu/Cu(O) multilayers exhibiting enhanced strength and tunable modulus Type de document : texte imprimé Auteurs : J. P. Chu, Auteur ; Y.-C. Wang, Auteur Année de publication : 2011 Article en page(s) : pp. 6371–6378 Note générale : Métallurgie Langues : Anglais (eng) Mots-clés : Sputtering  deposition  Multilayer  thin  film  Nanoindentation  AES  Secondary  ion  mass  spectroscopy Résumé : By means of brief pauses in radiofrequency (RF) sputter deposition between individual layers, ultrathin copper oxide layers were formed through adsorption in the Cu/Cu multilayers. Their mechanical properties were compared with the Cu/Cu(O) multilayers whose oxide layers were deliberately deposited between copper layers. The mechanical hardness value of the Cu/Cu(O) multilayers approached that of nanostructured copper thin films. The Young’s modulus of the multilayers was tunable, in accordance with the elasticity theories of composites. In addition, the Hall–Petch slope of the RF sputter-deposited Cu monolayers indicated that their theoretical strength approached the shear modulus of copper. DEWEY : 669 ISSN : 1359-6454 En ligne : http://www.sciencedirect.com/science/article/pii/S1359645410005021 [article] Sputter-deposited Cu/Cu(O) multilayers exhibiting enhanced strength and tunable modulus [texte imprimé] / J. P. Chu, Auteur ; Y.-C. Wang, Auteur . - 2011 . - pp. 6371–6378. Métallurgie Langues : Anglais (eng) in Acta materialia > Vol. 58 N° 19 (Novembre 2010) . - pp. 6371–6378 Mots-clés : Sputtering  deposition  Multilayer  thin  film  Nanoindentation  AES  Secondary  ion  mass  spectroscopy Résumé : By means of brief pauses in radiofrequency (RF) sputter deposition between individual layers, ultrathin copper oxide layers were formed through adsorption in the Cu/Cu multilayers. Their mechanical properties were compared with the Cu/Cu(O) multilayers whose oxide layers were deliberately deposited between copper layers. The mechanical hardness value of the Cu/Cu(O) multilayers approached that of nanostructured copper thin films. The Young’s modulus of the multilayers was tunable, in accordance with the elasticity theories of composites. In addition, the Hall–Petch slope of the RF sputter-deposited Cu monolayers indicated that their theoretical strength approached the shear modulus of copper. DEWEY : 669 ISSN : 1359-6454 En ligne : http://www.sciencedirect.com/science/article/pii/S1359645410005021