536 : Chaleur. Thermodynamique

536.05
536.2 Conduction, transmission de la chaleur. Conduction thermique, transmission thermique
536.24 Conduction d'un milieu à un autre. Transfert de chaleur. Echange. Transmission thermique
536.4 Action de la chaleur,de la température,sur les corps,sur les volumes ou sur leur structure.
536.5 Température. Echelles de température. Mesure et contrôle des températures. thermomètres. Thermométrie. Thermorégulation
536.6 Mesure de la quantité de chaleur. Calorimétrie
536.7 Thermodynamique. Energétique
536.7/621.4

Ouvrages de la bibliothèque en indexation 536

3D Integrated water cooling of a composite multilayer stack of chips / Fabio Alfieri in Journal of heat transfer, Vol. 132 N° 12 (Décembre 2010) 

Public ISBD [article]  in Journal of heat transfer > Vol. 132 N° 12 (Décembre 2010) . - pp.[121402-1/9] Titre : 3D Integrated water cooling of a composite multilayer stack of chips Type de document : texte imprimé Auteurs : Fabio Alfieri, Auteur ; Manish K. Tiwari, Auteur ; Igor Zinovik, Auteur Année de publication : 2010 Article en page(s) : pp.[121402-1/9] Note générale : Physique Langues : Anglais (eng) Mots-clés : 3D  chip  stack  Micropin-fun  Integrated  water  cooling  Conjugate  heat  transfer  modeling  Variable  properties  Thin  porous  medium  Nonthermal  equilibrium Index. décimale : 536 Chaleur. Thermodynamique Résumé : New generation supercomputers with three dimensional stacked chip architectures pose a major challenge with respect to the removal of dissipated heat, which can reach currently as high as 250 W/cm2 in multilayer chip stacks of less than 0.3 cm3 volume. Interlayer integrated water cooling is a very promising approach for such high heat flux removal due to much larger thermal capacity and conductivity of water compared with air, the traditional cooling fluid. In the current work, a multiscale conjugate heat transfer model is developed for integrated water cooling of chip layers and validated with experimental measurements on an especially designed thermal test vehicle that simulates a four tier chip stack with a footprint of 1 cm2. The cooling heat transfer structure, which consists of microchannels with cylindrical pin-fins, is conceived in such a way that it can be directly integrated with the device layout in multilayer chips. Every composite layer is cooled by water flow in microchannels (height of 100 µm), which are arranged in two port water inlet-outlet configuration. The total power removed in the stack is 390 W at a temperature gradient budget of 60 K from liquid inlet to maximal junction temperature, corresponding to about 1.3 kW/cm3 volumetric heat flow. The computational cost and complexity of detailed computational fluid dynamics (CFD) modeling of heat transfer in stacked chips with integrated cooling can be prohibitive. Therefore, the heat transfer structure is modeled using a porous medium approach, where the model parameters of heat transfer and hydrodynamic resistance are derived from averaging the results of the detailed 3D-CFD simulations of a single streamwise row of fins. The modeling results indicate that an isotropic porous medium model does not accurately predict the measured temperature fields. The variation of material properties due to temperature gradients is found to be large; therefore, variable properties are used in the model. It is also shown that the modeling of the heat transfer in the cooling sublayers requires the implementation of a porous medium approach with a local thermal nonequilibrium, as well as orthotropic heat conduction and hydrodynamic resistance. The improved model reproduces the temperatures measured in the stack within 10%. The model is used to predict the behavior of multilayer stacks mimicking the change of heat fluxes resulting from variations in the computational load of the chips during their operation. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...] [article] 3D Integrated water cooling of a composite multilayer stack of chips [texte imprimé] / Fabio Alfieri, Auteur ; Manish K. Tiwari, Auteur ; Igor Zinovik, Auteur . - 2010 . - pp.[121402-1/9]. Physique Langues : Anglais (eng) in Journal of heat transfer > Vol. 132 N° 12 (Décembre 2010) . - pp.[121402-1/9] Mots-clés : 3D  chip  stack  Micropin-fun  Integrated  water  cooling  Conjugate  heat  transfer  modeling  Variable  properties  Thin  porous  medium  Nonthermal  equilibrium Index. décimale : 536 Chaleur. Thermodynamique Résumé : New generation supercomputers with three dimensional stacked chip architectures pose a major challenge with respect to the removal of dissipated heat, which can reach currently as high as 250 W/cm2 in multilayer chip stacks of less than 0.3 cm3 volume. Interlayer integrated water cooling is a very promising approach for such high heat flux removal due to much larger thermal capacity and conductivity of water compared with air, the traditional cooling fluid. In the current work, a multiscale conjugate heat transfer model is developed for integrated water cooling of chip layers and validated with experimental measurements on an especially designed thermal test vehicle that simulates a four tier chip stack with a footprint of 1 cm2. The cooling heat transfer structure, which consists of microchannels with cylindrical pin-fins, is conceived in such a way that it can be directly integrated with the device layout in multilayer chips. Every composite layer is cooled by water flow in microchannels (height of 100 µm), which are arranged in two port water inlet-outlet configuration. The total power removed in the stack is 390 W at a temperature gradient budget of 60 K from liquid inlet to maximal junction temperature, corresponding to about 1.3 kW/cm3 volumetric heat flow. The computational cost and complexity of detailed computational fluid dynamics (CFD) modeling of heat transfer in stacked chips with integrated cooling can be prohibitive. Therefore, the heat transfer structure is modeled using a porous medium approach, where the model parameters of heat transfer and hydrodynamic resistance are derived from averaging the results of the detailed 3D-CFD simulations of a single streamwise row of fins. The modeling results indicate that an isotropic porous medium model does not accurately predict the measured temperature fields. The variation of material properties due to temperature gradients is found to be large; therefore, variable properties are used in the model. It is also shown that the modeling of the heat transfer in the cooling sublayers requires the implementation of a porous medium approach with a local thermal nonequilibrium, as well as orthotropic heat conduction and hydrodynamic resistance. The improved model reproduces the temperatures measured in the stack within 10%. The model is used to predict the behavior of multilayer stacks mimicking the change of heat fluxes resulting from variations in the computational load of the chips during their operation. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...]

Adhesin-specific nanomechanical cantilever biosensors for detection of microorganisms / Tzuen-Rong J. Tzeng in Journal of heat transfer, Vol. 133 N° 1(N° Spécial) (Janvier 2011) 

Public ISBD [article]  in Journal of heat transfer > Vol. 133 N° 1(N° Spécial) (Janvier 2011) . - pp. [011012/1-5] Titre : Adhesin-specific nanomechanical cantilever biosensors for detection of microorganisms Type de document : texte imprimé Auteurs : Tzuen-Rong J. Tzeng, Auteur ; Yunyan R. Cheng, Auteur ; Reza Saeidpourazar, Auteur Année de publication : 2011 Article en page(s) : pp. [011012/1-5] Note générale : Physique Langues : Anglais (eng) Mots-clés : Biosensors  Cantilevers  Microorganisms  Molecular  biophysics Index. décimale : 536 Chaleur. Thermodynamique Résumé : Lectins (adhesins) on bacterial surfaces play important roles in infection by mediating bacterial adherence to host cell surfaces via their cognate receptors. We have explored the use of alpha-D-mannose receptors as capturing agents for the detection of Escherichia coli using a microcantilever and have demonstrated that E. coli ORN178, which expresses normal type-1 pili, can interact with microcantilevers functionalized with alpha-D-mannose and can cause shifts in its resonance frequencies. Although E. coli ORN208, which expresses abnormal pili, binds poorly to alpha-D-mannose on the nitrocellulose membrane of a FAST slide, it did cause a detectable shift in resonance frequency when interacting with the alpha-D-mannose functionalized microcantilevers. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...] [article] Adhesin-specific nanomechanical cantilever biosensors for detection of microorganisms [texte imprimé] / Tzuen-Rong J. Tzeng, Auteur ; Yunyan R. Cheng, Auteur ; Reza Saeidpourazar, Auteur . - 2011 . - pp. [011012/1-5]. Physique Langues : Anglais (eng) in Journal of heat transfer > Vol. 133 N° 1(N° Spécial) (Janvier 2011) . - pp. [011012/1-5] Mots-clés : Biosensors  Cantilevers  Microorganisms  Molecular  biophysics Index. décimale : 536 Chaleur. Thermodynamique Résumé : Lectins (adhesins) on bacterial surfaces play important roles in infection by mediating bacterial adherence to host cell surfaces via their cognate receptors. We have explored the use of alpha-D-mannose receptors as capturing agents for the detection of Escherichia coli using a microcantilever and have demonstrated that E. coli ORN178, which expresses normal type-1 pili, can interact with microcantilevers functionalized with alpha-D-mannose and can cause shifts in its resonance frequencies. Although E. coli ORN208, which expresses abnormal pili, binds poorly to alpha-D-mannose on the nitrocellulose membrane of a FAST slide, it did cause a detectable shift in resonance frequency when interacting with the alpha-D-mannose functionalized microcantilevers. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...]

Adiabatic wall temperature evaluation in a high speed turbine / V. Pinilla in Journal of heat transfer, Vol 134 N° 9 (Septembre 2012) 

Public ISBD [article]  in Journal of heat transfer > Vol 134 N° 9 (Septembre 2012) . - 09 p. Titre : Adiabatic wall temperature evaluation in a high speed turbine Type de document : texte imprimé Auteurs : V. Pinilla, Auteur ; J. P. Solano, Auteur ; G. Paniagua, Auteur Année de publication : 2012 Article en page(s) : 09 p. Note générale : heat transfer Langues : Anglais (eng) Mots-clés : thin  film  gauges;  gas  turbine;  convective  heat  transfer Index. décimale : 536 Chaleur. Thermodynamique Résumé : Engine development requires accurate estimates of the heat loads. Estimates of the convective heat fluxes are particularly vital to assess the thermomechanical integrity of the turbomachinery components. This paper reports an experimental heat transfer research in a one and a half turbine stage, composed of a high-pressure turbine and a low-pressure vane. Measurements were performed in a compression tube facility at the von Karman Institute, able to reproduce engine representative Reynolds and Mach numbers. Double-layered thin film gauges were used to monitor the time-dependent temperature distribution around the airfoil. Several tests at different metal temperatures were performed to derive the adiabatic wall temperature. This research allowed quantifying the independent effects on the unsteady heat flux of the gas temperature fluctuations and boundary layer unsteadiness. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.org/getabs/servlet/GetabsServlet?prog=normal&id=JHTRAO000134000009 [...] [article] Adiabatic wall temperature evaluation in a high speed turbine [texte imprimé] / V. Pinilla, Auteur ; J. P. Solano, Auteur ; G. Paniagua, Auteur . - 2012 . - 09 p. heat transfer Langues : Anglais (eng) in Journal of heat transfer > Vol 134 N° 9 (Septembre 2012) . - 09 p. Mots-clés : thin  film  gauges;  gas  turbine;  convective  heat  transfer Index. décimale : 536 Chaleur. Thermodynamique Résumé : Engine development requires accurate estimates of the heat loads. Estimates of the convective heat fluxes are particularly vital to assess the thermomechanical integrity of the turbomachinery components. This paper reports an experimental heat transfer research in a one and a half turbine stage, composed of a high-pressure turbine and a low-pressure vane. Measurements were performed in a compression tube facility at the von Karman Institute, able to reproduce engine representative Reynolds and Mach numbers. Double-layered thin film gauges were used to monitor the time-dependent temperature distribution around the airfoil. Several tests at different metal temperatures were performed to derive the adiabatic wall temperature. This research allowed quantifying the independent effects on the unsteady heat flux of the gas temperature fluctuations and boundary layer unsteadiness. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.org/getabs/servlet/GetabsServlet?prog=normal&id=JHTRAO000134000009 [...]

Air-side heat-transfer enhancement by a new winglet-type vortex generator array in a plain-fin round-tube heat exchanger / J. He in Journal of heat transfer, Vol. 132 N° 7 (Juillet 2010) 

Public ISBD [article]  in Journal of heat transfer > Vol. 132 N° 7 (Juillet 2010) . - pp. [071801-1/9] Titre : Air-side heat-transfer enhancement by a new winglet-type vortex generator array in a plain-fin round-tube heat exchanger Type de document : texte imprimé Auteurs : J. He, Auteur ; L. Liu, Auteur ; A. M. Jacobi, Auteur Article en page(s) : pp. [071801-1/9] Note générale : Physique Langues : Anglais (eng) Mots-clés : Heat  exchanger  Fin-and-tube  V  formation  Vortex  generator  Winglet  array Index. décimale : 536 Chaleur. Thermodynamique Résumé : The impact of a vortex-generation technique for air-side heat-transfer improvement is experimentally investigated through full-scale wind-tunnel testing of a plain-fin round-tube heat exchanger under dry-surface conditions. Inspired by the formation locomotion of animals in nature, a new vortex generator (VG) array deployed in a “V” is proposed in the present work, aiming to create constructive interference between vortices. The array is composed of two delta-winglet pairs and placed at an attack angle of 10 deg or 30 deg. Its effectiveness is compared with a baseline configuration and two conventional single-pair designs placed at 30 deg, a small pair with half the area of the array and a large pair with the same area as the array. The frontal air velocity considered ranges from 2.3 m/s to 5.5 m/s, corresponding to a Reynolds number range based on the hydraulic diameter of 1400–3400. The experimental results show little impact of the 10 deg array and a moderate heat-transfer improvement of up to 32% for the small pair, both introducing additional pressure loss of approximately 20–40%. For the 30 deg array and the large pair, similar augmentation of 25–55% in air-side heat-transfer coefficient is obtained accompanied by average pressure drop penalties of 90% and 140%, respectively. Performance evaluation using the criteria of the modified area goodness factor and the volume goodness factor indicates the superiority of the heat exchanger enhanced by the 30 deg array among all the investigated VGs. The VG array is found more effective at comparatively low Reynolds numbers, representative of many heating, ventilation, air-conditioning, and refrigeration applications and compact heat-exchanger designs. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...] [article] Air-side heat-transfer enhancement by a new winglet-type vortex generator array in a plain-fin round-tube heat exchanger [texte imprimé] / J. He, Auteur ; L. Liu, Auteur ; A. M. Jacobi, Auteur . - pp. [071801-1/9]. Physique Langues : Anglais (eng) in Journal of heat transfer > Vol. 132 N° 7 (Juillet 2010) . - pp. [071801-1/9] Mots-clés : Heat  exchanger  Fin-and-tube  V  formation  Vortex  generator  Winglet  array Index. décimale : 536 Chaleur. Thermodynamique Résumé : The impact of a vortex-generation technique for air-side heat-transfer improvement is experimentally investigated through full-scale wind-tunnel testing of a plain-fin round-tube heat exchanger under dry-surface conditions. Inspired by the formation locomotion of animals in nature, a new vortex generator (VG) array deployed in a “V” is proposed in the present work, aiming to create constructive interference between vortices. The array is composed of two delta-winglet pairs and placed at an attack angle of 10 deg or 30 deg. Its effectiveness is compared with a baseline configuration and two conventional single-pair designs placed at 30 deg, a small pair with half the area of the array and a large pair with the same area as the array. The frontal air velocity considered ranges from 2.3 m/s to 5.5 m/s, corresponding to a Reynolds number range based on the hydraulic diameter of 1400–3400. The experimental results show little impact of the 10 deg array and a moderate heat-transfer improvement of up to 32% for the small pair, both introducing additional pressure loss of approximately 20–40%. For the 30 deg array and the large pair, similar augmentation of 25–55% in air-side heat-transfer coefficient is obtained accompanied by average pressure drop penalties of 90% and 140%, respectively. Performance evaluation using the criteria of the modified area goodness factor and the volume goodness factor indicates the superiority of the heat exchanger enhanced by the 30 deg array among all the investigated VGs. The VG array is found more effective at comparatively low Reynolds numbers, representative of many heating, ventilation, air-conditioning, and refrigeration applications and compact heat-exchanger designs. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...]

Airflow and cooling in a data center / Suhas V. Patankar in Journal of heat transfer, Vol. 132 N° 7 (Juillet 2010) 

Public ISBD [article]  in Journal of heat transfer > Vol. 132 N° 7 (Juillet 2010) . - pp. [073001-1/17] Titre : Airflow and cooling in a data center Type de document : texte imprimé Auteurs : Suhas V. Patankar, Auteur Article en page(s) : pp. [073001-1/17] Note générale : Physique Langues : Anglais (eng) Mots-clés : Data  center  Electronics  cooling  Raised  floor  Under-floor  flow  simulation  Computational  fluid  dynamics Index. décimale : 536 Chaleur. Thermodynamique Résumé : This paper deals with the distribution of airflow and the resulting cooling in a data center. First, the cooling challenge is described and the concept of a raised-floor data center is introduced. In this arrangement, cooling air is supplied through perforated tiles. The flow rates of the cooling air must meet the cooling requirements of the computer servers placed next to the tiles. These airflow rates are governed primarily by the pressure distribution under the raised floor. Thus, the key to modifying the flow rates is to influence the flow field in the under-floor plenum. Computational fluid dynamics (CFD) is used to provide insight into various factors affecting the airflow distribution and the corresponding cooling. A number of ways of controlling the airflow distribution are explored. Then attention is turned to the above-floor space, where the focus is on preventing the hot air from entering the inlets of computer serves. Different strategies for doing this are considered. The paper includes a number of comparisons of measurements with the results of CFD simulations. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...] [article] Airflow and cooling in a data center [texte imprimé] / Suhas V. Patankar, Auteur . - pp. [073001-1/17]. Physique Langues : Anglais (eng) in Journal of heat transfer > Vol. 132 N° 7 (Juillet 2010) . - pp. [073001-1/17] Mots-clés : Data  center  Electronics  cooling  Raised  floor  Under-floor  flow  simulation  Computational  fluid  dynamics Index. décimale : 536 Chaleur. Thermodynamique Résumé : This paper deals with the distribution of airflow and the resulting cooling in a data center. First, the cooling challenge is described and the concept of a raised-floor data center is introduced. In this arrangement, cooling air is supplied through perforated tiles. The flow rates of the cooling air must meet the cooling requirements of the computer servers placed next to the tiles. These airflow rates are governed primarily by the pressure distribution under the raised floor. Thus, the key to modifying the flow rates is to influence the flow field in the under-floor plenum. Computational fluid dynamics (CFD) is used to provide insight into various factors affecting the airflow distribution and the corresponding cooling. A number of ways of controlling the airflow distribution are explored. Then attention is turned to the above-floor space, where the focus is on preventing the hot air from entering the inlets of computer serves. Different strategies for doing this are considered. The paper includes a number of comparisons of measurements with the results of CFD simulations. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.aip.org/vsearch/servlet/VerityServlet?KEY=JHTRAO&ONLINE=YES&smode= [...]

An accurate and stable numerical method for solving a micro heat transfer model in a one-dimensional N-Carrier system in spherical coordinates / Weizhong Dai in Journal of heat transfer, Vol. 134 N° 5 (Mai 2012) 

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An efficient sparse finite element solver for the radiative transfer equatioe / Gisela Widmer in Journal of heat transfer, Vol. 132 N° 2 (n° spécial) (Fevrier 2010) 

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An experimental and numerical investigation on the thermal-hydraulic performance of double notched plate / Zhang, Lei in Journal of heat transfer, Vol 134 N° 9 (Septembre 2012) 

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An experimental and numerical study of heat transfer from arrays of impinging jets with surface ribs / Sebastian Spring in Journal of heat transfer, Vol. 134 N° 8 (special issue) (Août 2012) 

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An experimental investigation of performance and exergy analysis of a counterflow vortex tube having various nozzle numbers at different inlet pressures of air, oxygen, nitrogen, and argon / Volkan Kirmaci in Journal of heat transfer, Vol. 132 N° 12 (Décembre 2010) 

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An experimental study to show the effect of thermal stress on thermal contact conductance at sub-megapascal contact pressures / Prashant Misra in Journal of heat transfer, Vol. 132 N° 9 (Septembre 2010) 

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An experimentally validated numerical modeling technique for perforated plate heat exchangers / M. J. White in Journal of heat transfer, Vol. 132 N° 11 (Novembre 2010) 

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An extension of the large-cell radiation model for the case of semitransparent nonisothermal particles / Leonid A. Dombrovsky in Journal of heat transfer, Vol. 132 N° 2 (n° spécial) (Fevrier 2010) 

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An extension to the Navier–Stokes equations to incorporate gas molecular collisions with boundaries / Erik J. Arlemark in Journal of heat transfer, Vol. 132 N° 4 (n° spécial) (Avril 2010) 

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An improved volume of fluid method for two-phase flow computations on collocated grid system / Dong-Liang Sun in Journal of heat transfer, Vol. 133 N° 4 (Avril 2011) 

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