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Thermal management of on-chip hot spot / Avram Bar-Cohen in Journal of heat transfer, Vol. 134 N° 5 (Mai 2012) 

Public ISBD [article]  in Journal of heat transfer > Vol. 134 N° 5 (Mai 2012) . - 11 p. Titre : Thermal management of on-chip hot spot Type de document : texte imprimé Auteurs : Avram Bar-Cohen, Auteur ; Peng Wang, Auteur Année de publication : 2012 Article en page(s) : 11 p. Note générale : heat transfer Langues : Anglais (eng) Mots-clés : hot  spot;  electronics  cooling;  thermoelectric  cooler;  two-phase;  micrograp  cooler Index. décimale : 536 Chaleur. Thermodynamique Résumé : The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in microprocessor chip heat flux and growing concern over the emergence of on-chip hot spots. The application of on-chip high flux cooling techniques is today a primary driver for innovation in the electronics industry. In this paper, the physical phenomena underpinning the most promising on-chip thermal management approaches for hot spot remediation, along with basic modeling equations and typical results are described. Attention is devoted to thermoelectric micro-coolers and two-phase microgap coolers. The advantages and disadvantages of these on-chip cooling solutions for high heat flux hot spots are evaluated and compared. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.org/getabs/servlet/GetabsServlet?prog=normal&id=JHTRAO000134000005 [...] [article] Thermal management of on-chip hot spot [texte imprimé] / Avram Bar-Cohen, Auteur ; Peng Wang, Auteur . - 2012 . - 11 p. heat transfer Langues : Anglais (eng) in Journal of heat transfer > Vol. 134 N° 5 (Mai 2012) . - 11 p. Mots-clés : hot  spot;  electronics  cooling;  thermoelectric  cooler;  two-phase;  micrograp  cooler Index. décimale : 536 Chaleur. Thermodynamique Résumé : The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in microprocessor chip heat flux and growing concern over the emergence of on-chip hot spots. The application of on-chip high flux cooling techniques is today a primary driver for innovation in the electronics industry. In this paper, the physical phenomena underpinning the most promising on-chip thermal management approaches for hot spot remediation, along with basic modeling equations and typical results are described. Attention is devoted to thermoelectric micro-coolers and two-phase microgap coolers. The advantages and disadvantages of these on-chip cooling solutions for high heat flux hot spots are evaluated and compared. DEWEY : 536 ISSN : 0022-1481 En ligne : http://asmedl.org/getabs/servlet/GetabsServlet?prog=normal&id=JHTRAO000134000005 [...]