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Electrochemical corrosion behaviour of Sn–Ag–Cu (SAC) eutectic alloy in a chloride containing environment / F. Rosalbino in Materials and corrosion, Vol. 63 N° 6 (Juin 2012) 

Public ISBD [article]  in Materials and corrosion > Vol. 63 N° 6 (Juin 2012) . - pp. 492–496 Titre : Electrochemical corrosion behaviour of Sn–Ag–Cu (SAC) eutectic alloy in a chloride containing environment Type de document : texte imprimé Auteurs : F. Rosalbino, Auteur ; G. Zanicchi, Auteur ; R. Carlini, Auteur Année de publication : 2012 Article en page(s) : pp. 492–496 Note générale : Génie mécanique Langues : Anglais (eng) Mots-clés : Electrochemical  impedance  spectroscopy  (EIS);  NaCl  solution;  polarization  curves;  Sn–Ag–Cu  eutectic  alloy;  tin  oxy-chloride Résumé : The corrosion behaviour of the Sn94.5Ag3.8Cu1.5 (SAC) eutectic alloy was investigated in 0.1 M NaCl solution by potentiodynamic polarization and impedance spectroscopy measurements and compared with that of the conventional Sn73.9Pb23.1 eutectic solder employed for a long time in the packaging of microelectronic components and devices. Scanning electron microscopy (SEM) and electron probe microanalysis (EPMA) were used to characterize the SAC eutectic alloy prior to and after the electrochemical tests. The electrochemical results indicated that the Sn–Ag–Cu eutectic alloy exhibits better corrosion behaviour than the Sn–Pb eutectic solder in NaCl solution. The presence of a corrosion products layer constituted by tin oxy-chloride was detected at the surface of both alloys investigated after the electrochemical tests. The better corrosion behaviour of SAC eutectic alloy compared to Sn–Pb eutectic solder is ascribed to the formation of a more compact surface film of corrosion products with improved protective properties owing to the presence of copper and silver, as revealed by EPMA. En ligne : http://onlinelibrary.wiley.com/doi/10.1002/maco.201005979/abstract [article] Electrochemical corrosion behaviour of Sn–Ag–Cu (SAC) eutectic alloy in a chloride containing environment [texte imprimé] / F. Rosalbino, Auteur ; G. Zanicchi, Auteur ; R. Carlini, Auteur . - 2012 . - pp. 492–496. Génie mécanique Langues : Anglais (eng) in Materials and corrosion > Vol. 63 N° 6 (Juin 2012) . - pp. 492–496 Mots-clés : Electrochemical  impedance  spectroscopy  (EIS);  NaCl  solution;  polarization  curves;  Sn–Ag–Cu  eutectic  alloy;  tin  oxy-chloride Résumé : The corrosion behaviour of the Sn94.5Ag3.8Cu1.5 (SAC) eutectic alloy was investigated in 0.1 M NaCl solution by potentiodynamic polarization and impedance spectroscopy measurements and compared with that of the conventional Sn73.9Pb23.1 eutectic solder employed for a long time in the packaging of microelectronic components and devices. Scanning electron microscopy (SEM) and electron probe microanalysis (EPMA) were used to characterize the SAC eutectic alloy prior to and after the electrochemical tests. The electrochemical results indicated that the Sn–Ag–Cu eutectic alloy exhibits better corrosion behaviour than the Sn–Pb eutectic solder in NaCl solution. The presence of a corrosion products layer constituted by tin oxy-chloride was detected at the surface of both alloys investigated after the electrochemical tests. The better corrosion behaviour of SAC eutectic alloy compared to Sn–Pb eutectic solder is ascribed to the formation of a more compact surface film of corrosion products with improved protective properties owing to the presence of copper and silver, as revealed by EPMA. En ligne : http://onlinelibrary.wiley.com/doi/10.1002/maco.201005979/abstract