Corrosion behaviour of Ti–Ta–Sn alloy systems in 0.9% NaCl solution / W. Q. Khan in Materials and corrosion, Vol. 63 N° 11 (Novembre 2012)  

Public ISBD [article]  inMaterials and corrosion > Vol. 63 N° 11 (Novembre 2012) . - pp. 992–996 Titre : Corrosion behaviour of Ti–Ta–Sn alloy systems in 0.9% NaCl solution Type de document : texte imprimé Auteurs : W. Q. Khan, Auteur ; K. M. Deen, Auteur ; K. M. Ghauri, Auteur Année de publication : 2014 Article en page(s) : pp. 992–996 Note générale : Génie mécanique Langues : Anglais (eng) Mots-clés : Electrochemical  electrochemical impedance spectroscopy  microstructural  passive film  X-ray diffraction Résumé : Two alloys of varying contents of tantalum (Ta) and tin (Sn) were prepared and homogenized to evaluate their microstructural and electrochemical characteristics. The microstructural features were revealed through optical microscopy and X-ray diffraction methods. The formation and stability of passive film was studied by open circuit potential, potentiodynamic polarization and electrochemical scratch tests. The electrochemical impedance spectroscopy results simulated with equivalent electrical circuit suggested bilayer structure of outer porous and inner barrier oxide films. The quantitative data showed thick inner barrier oxide film retarded electrochemical reactions at low ‘Ta’ and ‘Sn’ concentration. The increased percentage of ‘Ta’ and ‘Sn’ deteriorated barrier properties by agglomeration of Ta2Sn3 and Ta0.15Ti0.85 precipitates within grains and at the grain boundaries. En ligne : http://onlinelibrary.wiley.com/doi/10.1002/maco.201206523/abstract [article] Corrosion behaviour of Ti–Ta–Sn alloy systems in 0.9% NaCl solution [texte imprimé] / W. Q. Khan, Auteur ; K. M. Deen, Auteur ; K. M. Ghauri, Auteur . - 2014 . - pp. 992–996. Génie mécanique Langues : Anglais (eng) in Materials and corrosion > Vol. 63 N° 11 (Novembre 2012) . - pp. 992–996 Mots-clés : Electrochemical  electrochemical impedance spectroscopy  microstructural  passive film  X-ray diffraction Résumé : Two alloys of varying contents of tantalum (Ta) and tin (Sn) were prepared and homogenized to evaluate their microstructural and electrochemical characteristics. The microstructural features were revealed through optical microscopy and X-ray diffraction methods. The formation and stability of passive film was studied by open circuit potential, potentiodynamic polarization and electrochemical scratch tests. The electrochemical impedance spectroscopy results simulated with equivalent electrical circuit suggested bilayer structure of outer porous and inner barrier oxide films. The quantitative data showed thick inner barrier oxide film retarded electrochemical reactions at low ‘Ta’ and ‘Sn’ concentration. The increased percentage of ‘Ta’ and ‘Sn’ deteriorated barrier properties by agglomeration of Ta2Sn3 and Ta0.15Ti0.85 precipitates within grains and at the grain boundaries. En ligne : http://onlinelibrary.wiley.com/doi/10.1002/maco.201206523/abstract

Exemplaires

Code-barres	Cote	Support	Localisation	Section	Disponibilité
aucun exemplaire