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Exploring the water-soluble phosphine ligand as the environmentally friendly stabilizer for electroless nickel plating / Ke Wang in Industrial & engineering chemistry research, Vol. 48 N°4 (Février 2009) 

Public ISBD [article]  in Industrial & engineering chemistry research > Vol. 48 N°4 (Février 2009) . - pp. 1727–1734 Titre : Exploring the water-soluble phosphine ligand as the environmentally friendly stabilizer for electroless nickel plating Type de document : texte imprimé Auteurs : Ke Wang, Auteur ; Liang Hong, Auteur ; Zhao-Lin Liu, Auteur Année de publication : 2009 Article en page(s) : pp. 1727–1734 Note générale : Chemical engineering Langues : Anglais (eng) Mots-clés : Phosphine  compounds  Nickel  atom  Water-soluble  phosphine  Electroless  nickel  plating Résumé : Phosphine (R3P) compounds being a typical type of coordination ligand used in homogeneous catalysis are known to possess a tunable affinity with the nickel atom. As such, it deserves to be studied whether a water-soluble phosphine ligand could also be used as a plating stabilizer in the electroless nickel plating (ENP) system in place of hazardous Pb(II) salt and what will be the unique effects generated due to this replacement. Triphenylphosphine-3,3′,3′′-trisulfonic acid trisodium salt (TPPTS) was then chosen as a model phosphine stabilizer to perform the study. TPPTS could indeed work to prevent the ENP process from running out of control. In addition, unlike the existing ENP stabilizers, TPPTS does not reveal a percolation concentration for a sharp ceasing of plating. Also according to the voltammetry investigation, TPPTS can be classified as a cathodic stabilizer. A Ni−P plating layer with high phosphorus content (>15%) has been achieved using10−4 mol/L TPPTS in the plating bath. Furthermore, this work investigated the relation between P weight percent and corrosion resistance of either the as-plated or the annealed Ni−P plating layer by electrochemical impedance spectroscopy (EIS). The annealing was found, according to the depth profile analysis, to drive diffusion of both Ni and P toward the bulk phase, which strongly revamps corrosion resistance of the plating layer. Finally, the stability of the ENP bath was evaluated using the metal-turnover (MTO) test. En ligne : http://pubs.acs.org/doi/abs/10.1021/ie801456f [article] Exploring the water-soluble phosphine ligand as the environmentally friendly stabilizer for electroless nickel plating [texte imprimé] / Ke Wang, Auteur ; Liang Hong, Auteur ; Zhao-Lin Liu, Auteur . - 2009 . - pp. 1727–1734. Chemical engineering Langues : Anglais (eng) in Industrial & engineering chemistry research > Vol. 48 N°4 (Février 2009) . - pp. 1727–1734 Mots-clés : Phosphine  compounds  Nickel  atom  Water-soluble  phosphine  Electroless  nickel  plating Résumé : Phosphine (R3P) compounds being a typical type of coordination ligand used in homogeneous catalysis are known to possess a tunable affinity with the nickel atom. As such, it deserves to be studied whether a water-soluble phosphine ligand could also be used as a plating stabilizer in the electroless nickel plating (ENP) system in place of hazardous Pb(II) salt and what will be the unique effects generated due to this replacement. Triphenylphosphine-3,3′,3′′-trisulfonic acid trisodium salt (TPPTS) was then chosen as a model phosphine stabilizer to perform the study. TPPTS could indeed work to prevent the ENP process from running out of control. In addition, unlike the existing ENP stabilizers, TPPTS does not reveal a percolation concentration for a sharp ceasing of plating. Also according to the voltammetry investigation, TPPTS can be classified as a cathodic stabilizer. A Ni−P plating layer with high phosphorus content (>15%) has been achieved using10−4 mol/L TPPTS in the plating bath. Furthermore, this work investigated the relation between P weight percent and corrosion resistance of either the as-plated or the annealed Ni−P plating layer by electrochemical impedance spectroscopy (EIS). The annealing was found, according to the depth profile analysis, to drive diffusion of both Ni and P toward the bulk phase, which strongly revamps corrosion resistance of the plating layer. Finally, the stability of the ENP bath was evaluated using the metal-turnover (MTO) test. En ligne : http://pubs.acs.org/doi/abs/10.1021/ie801456f

Investigation into the roles of sulfur-containing amino acids in electroless nickel plating bath / Ke Wang in Industrial & engineering chemistry research, Vol. 47 N°17 (Septembre 2008) 

Public ISBD [article]  in Industrial & engineering chemistry research > Vol. 47 N°17 (Septembre 2008) . - p. 6517–6524 Titre : Investigation into the roles of sulfur-containing amino acids in electroless nickel plating bath Type de document : texte imprimé Auteurs : Ke Wang, Auteur ; Liang Hong, Auteur ; Zhao-Lin Liu, Auteur Année de publication : 2008 Article en page(s) : p. 6517–6524 Note générale : Chemical engineering Langues : Anglais (eng) Mots-clés : Sulfur-containing  amino  acids  Electroless  nickel  plating  Chemical  adsorption Résumé : Typical sulfur-containing amino acids, cysteine and methionine, were employed as stabilizers in place of lead(II) acetate in the electroless nickel plating (ENP) system. Each of these compounds presents a critical stabilizing concentration of ca. 10−5 mol/L, below which the ENP rate is slightly promoted with increasing concentration but above which it is significantly suppressed. Their role in stabilizing the ENP bath was found to involve inhibition of the anodic reaction of hypophosphite. The chemical adsorption of these two amino acids on active nickel sites at the Ni plating surface was studied via their adsorption on an in situ generated Ni powder. In addition, the stabilization mechanism was investigated by using potentiometry, X-ray photoelectron spectroscopy (XPS), and UV−vis/infrared spectroscopy. Finally, the bath stabilizing capabilities of these two amino acids and the change in ENP properties with time were assessed through a continuous operation comprising four metal-turnover (MTO) runs. En ligne : http://pubs.acs.org/doi/abs/10.1021/ie800456b [article] Investigation into the roles of sulfur-containing amino acids in electroless nickel plating bath [texte imprimé] / Ke Wang, Auteur ; Liang Hong, Auteur ; Zhao-Lin Liu, Auteur . - 2008 . - p. 6517–6524. Chemical engineering Langues : Anglais (eng) in Industrial & engineering chemistry research > Vol. 47 N°17 (Septembre 2008) . - p. 6517–6524 Mots-clés : Sulfur-containing  amino  acids  Electroless  nickel  plating  Chemical  adsorption Résumé : Typical sulfur-containing amino acids, cysteine and methionine, were employed as stabilizers in place of lead(II) acetate in the electroless nickel plating (ENP) system. Each of these compounds presents a critical stabilizing concentration of ca. 10−5 mol/L, below which the ENP rate is slightly promoted with increasing concentration but above which it is significantly suppressed. Their role in stabilizing the ENP bath was found to involve inhibition of the anodic reaction of hypophosphite. The chemical adsorption of these two amino acids on active nickel sites at the Ni plating surface was studied via their adsorption on an in situ generated Ni powder. In addition, the stabilization mechanism was investigated by using potentiometry, X-ray photoelectron spectroscopy (XPS), and UV−vis/infrared spectroscopy. Finally, the bath stabilizing capabilities of these two amino acids and the change in ENP properties with time were assessed through a continuous operation comprising four metal-turnover (MTO) runs. En ligne : http://pubs.acs.org/doi/abs/10.1021/ie800456b