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The effect of oven-heat flux on powder-coating issues of sheet molding compound panels / Soumendra K. Basu in Industrial & engineering chemistry research, Vol. 48 N°3 (Février 2009) 

Public ISBD [article]  in Industrial & engineering chemistry research > Vol. 48 N°3 (Février 2009) . - p. 1638–1649 Titre : The effect of oven-heat flux on powder-coating issues of sheet molding compound panels Type de document : texte imprimé Auteurs : Soumendra K. Basu, Auteur ; Bhavesh Shah, Auteur ; Hamid G. Kia, Auteur Année de publication : 2009 Article en page(s) : p. 1638–1649 Note générale : Chemical engineering Langues : Anglais (eng) Mots-clés : Powder-coating  Powder  bake  Oven-Heat  --  effect Résumé : The effects of variations in the powder bake temperature profile on the paint popping defect of sheet molding compound (SMC) panels was investigated by subjecting powder-coated panels to various heating rates using IR heaters and convective ovens, and by using a mathematical model of heat transfer and curing reaction. It was found that overheating the SMC than that required for optimum powder curing can cause high rates of outgassing of absorbed moisture and, therefore, excessive popping. It was further found that higher quantity of moisture outgassing per unit time through the molten primer layer during a fast temperature ramp causes more popping compared to a slow temperature ramp. Therefore, it is expected that any plant that is experiencing paint popping would benefit from slowing down the rate of temperature rise of the panels during the initial 5−10 min of the heating cycle. En ligne : http://pubs.acs.org/doi/abs/10.1021/ie801130g [article] The effect of oven-heat flux on powder-coating issues of sheet molding compound panels [texte imprimé] / Soumendra K. Basu, Auteur ; Bhavesh Shah, Auteur ; Hamid G. Kia, Auteur . - 2009 . - p. 1638–1649. Chemical engineering Langues : Anglais (eng) in Industrial & engineering chemistry research > Vol. 48 N°3 (Février 2009) . - p. 1638–1649 Mots-clés : Powder-coating  Powder  bake  Oven-Heat  --  effect Résumé : The effects of variations in the powder bake temperature profile on the paint popping defect of sheet molding compound (SMC) panels was investigated by subjecting powder-coated panels to various heating rates using IR heaters and convective ovens, and by using a mathematical model of heat transfer and curing reaction. It was found that overheating the SMC than that required for optimum powder curing can cause high rates of outgassing of absorbed moisture and, therefore, excessive popping. It was further found that higher quantity of moisture outgassing per unit time through the molten primer layer during a fast temperature ramp causes more popping compared to a slow temperature ramp. Therefore, it is expected that any plant that is experiencing paint popping would benefit from slowing down the rate of temperature rise of the panels during the initial 5−10 min of the heating cycle. En ligne : http://pubs.acs.org/doi/abs/10.1021/ie801130g